
AMD Xilinx
XC4085XLA-07HQ208C
XC4085XLA-07HQ208C ECAD Model
XC4085XLA-07HQ208C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 160 | |
Number of Outputs | 160 | |
Number of Logic Cells | 7448 | |
Number of Equivalent Gates | 55000 | |
Number of CLBs | 3136 | |
Combinatorial Delay of a CLB-Max | 900 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3136 CLBS, 55000 GATES | |
Additional Feature | CAN ALSO USE 180000 GATES | |
Clock Frequency-Max | 294 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFQFP | |
Package Equivalence Code | HQFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP-208 | |
Pin Count | 208 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC4085XLA-07HQ208C Datasheet Download
XC4085XLA-07HQ208C Overview
The XC4085XLA-07HQ208C chip model is a highly advanced integrated circuit (IC) designed for use in a variety of applications. It is considered to be one of the most advanced chip models available on the market today. This chip model is highly reliable, cost-effective, and provides excellent performance. It is suitable for a variety of applications, including networking, embedded systems, and consumer electronics.
The XC4085XLA-07HQ208C chip model is designed to meet the needs of today's advanced technology. It is designed with a wide range of features and capabilities that make it suitable for both current and future applications. Its features include fast data transfer rates, low power consumption, and a wide range of integrated peripherals. These features make the chip model ideal for a variety of applications, including networking, embedded systems, and consumer electronics.
The XC4085XLA-07HQ208C chip model is expected to be in high demand in the future. As technology advances, the demand for advanced integrated circuits will continue to grow. This chip model is expected to be used in a variety of applications, from networking and embedded systems to consumer electronics. It is also expected to be used in the era of fully intelligent systems, as it has the capabilities to support these types of applications.
The XC4085XLA-07HQ208C chip model is also expected to be used in a variety of networks. It is designed with features that make it suitable for a variety of networking scenarios, such as wireless networks, wired networks, and mesh networks. It is also expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation.
The XC4085XLA-07HQ208C chip model is expected to be in high demand in the future due to its advanced features and capabilities. It is designed to meet the needs of today's advanced technology and is expected to be used in a variety of applications. It is also expected to be used in the era of fully intelligent systems, as it has the capabilities to support these types of applications. It is also expected to be used in a variety of networks, making it suitable for a variety of networking scenarios. Finally, it is expected to be used in a variety of intelligent scenarios, making it suitable for a variety of intelligent applications.
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