XC4085XLA-07BGG432C
XC4085XLA-07BGG432C
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rohs

AMD Xilinx

XC4085XLA-07BGG432C


XC4085XLA-07BGG432C
F20-XC4085XLA-07BGG432C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XC4085XLA-07BGG432C ECAD Model


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XC4085XLA-07BGG432C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 55000
Number of CLBs 3136
Combinatorial Delay of a CLB-Max 900 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3136 CLBS, 55000 GATES
Additional Feature CAN ALSO USE 180000 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 432
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4085XLA-07BGG432C Datasheet Download


XC4085XLA-07BGG432C Overview



The XC4085XLA-07BGG432C chip model is a versatile device that is used in a variety of industries. It is a type of Field Programmable Gate Array (FPGA) that is designed to be easily reprogrammable and reconfigurable. This makes it an ideal choice for applications that require a high degree of flexibility and scalability.


The XC4085XLA-07BGG432C chip model is based on a Xilinx Virtex-4 FPGA architecture, which is optimized for high-performance, low-power, and low-cost applications. It also features a wide range of memory, logic, and I/O capabilities, making it suitable for a variety of applications.


The XC4085XLA-07BGG432C chip model has several advantages that make it an attractive choice for a variety of industries. It is highly reliable, and its low power consumption makes it an ideal choice for applications that require low power consumption. It also has a high degree of scalability, which makes it suitable for applications that need to be easily reconfigured or upgraded.


In terms of future industry trends, the XC4085XLA-07BGG432C chip model is expected to see increasing demand in a variety of industries. It is expected to be used in applications such as automotive, aerospace, industrial automation, medical, and consumer electronics. This is due to its versatility, scalability, and low power consumption.


In terms of product description and design requirements, the XC4085XLA-07BGG432C chip model features a wide range of features that make it suitable for a variety of applications. It has a maximum operating frequency of 250 MHz, with a total logic capacity of up to 8,192 logic cells. It also features up to 16 I/O banks, with up to 128 I/O pins per bank. It also has a wide range of memory options, including up to 32 MB of QDRII+ SRAM, up to 8 MB of Flash, and up to 4 MB of block RAM.


In terms of actual case studies, the XC4085XLA-07BGG432C chip model has been used in a variety of applications. It has been used in applications such as automotive, aerospace, industrial automation, medical, and consumer electronics. In automotive applications, it has been used in a variety of applications, such as in-vehicle infotainment systems, vehicle control systems, and driver assistance systems. In aerospace applications, it has been used in a variety of applications, such as avionics, navigation, and communication systems. In industrial automation applications, it has been used in a variety of applications, such as machine vision systems, robotic systems, and industrial control systems.


Finally, in terms of precautions, it is important to note that the XC4085XLA-07BGG432C chip model is a complex device and requires a certain level of expertise to use and configure correctly. It is also important to ensure that the chip model is properly supported by the application environment, as some applications may require the support of new technologies. Therefore, it is important to ensure that the application environment is up-to-date and that the chip model is properly configured and supported by the application environment.



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