AMD Xilinx
XC4085XLA-07BGG352C
XC4085XLA-07BGG352C ECAD Model
XC4085XLA-07BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-07BGG352C Datasheet Download
XC4085XLA-07BGG352C Overview
The XC4085XLA-07BGG352C chip model is a high-performance, low-power integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language and is a great choice for a variety of applications.
The XC4085XLA-07BGG352C chip model is designed to provide high-performance, low-power operation, making it ideal for use in a variety of applications. It is designed with the latest technologies and is capable of providing the necessary performance for a variety of applications. It is also designed to be upgradable, allowing it to keep up with the latest trends and technologies.
The original design intention of the XC4085XLA-07BGG352C chip model was to provide a high-performance, low-power integrated circuit that could be used in a variety of applications. It was designed to provide the necessary performance for high-performance digital signal processing, embedded processing, image processing, and other applications. It is also designed to be upgradable, allowing it to keep up with the latest trends and technologies.
The XC4085XLA-07BGG352C chip model can be used in a variety of applications, including advanced communication systems. It is capable of providing the necessary performance for these applications, and can be upgraded to keep up with the latest trends and technologies. It is also designed to be compatible with the latest technologies, making it a great choice for a variety of applications.
The XC4085XLA-07BGG352C chip model is a great choice for a variety of applications. It is designed to provide high-performance, low-power operation, making it ideal for use in a variety of applications. It is also designed to be upgradable, allowing it to keep up with the latest trends and technologies. It is also designed to be compatible with the latest technologies, making it a great choice for a variety of applications. The XC4085XLA-07BGG352C chip model is a great choice for a variety of applications and is sure to be a great choice for the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||