AMD Xilinx
XC4085XLA-07BG560C
XC4085XLA-07BG560C ECAD Model
XC4085XLA-07BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 |
XC4085XLA-07BG560C Datasheet Download
XC4085XLA-07BG560C Overview
The XC4085XLA-07BG560C chip model has been a popular choice among consumers and manufacturers due to its wide range of features and capabilities. This chip model is designed to meet the needs of a variety of applications and is capable of delivering a high level of performance. It is also highly reliable and cost-effective.
The XC4085XLA-07BG560C chip model is a low-power, high-speed, and low-cost solution for a variety of applications. It can be used in a wide range of applications, from automotive to consumer electronics. Its features include a wide range of operating frequencies, low power consumption, and low power dissipation. It also has a wide range of interfaces, making it suitable for a variety of applications.
In the future, the XC4085XLA-07BG560C chip model is expected to be in high demand in the automotive, consumer electronics, and industrial sectors. This is due to its low power consumption and high performance. In addition, its low cost makes it a cost-effective solution for many applications.
The XC4085XLA-07BG560C chip model has been designed to meet the requirements of a variety of applications. It has a wide range of operating frequencies, low power consumption, and low power dissipation. It also has a wide range of interfaces, making it suitable for a variety of applications. It is also highly reliable and cost-effective.
The product description of the XC4085XLA-07BG560C chip model includes its features, such as its wide range of operating frequencies, low power consumption, and low power dissipation. It also has a wide range of interfaces, making it suitable for a variety of applications. It is also highly reliable and cost-effective.
In addition to the product description, the design requirements of the XC4085XLA-07BG560C chip model should also be considered. This includes the specific requirements for the chip model, such as the number of pins, the type of package, and the type of process used. In addition, the design requirements should also include the specific design requirements for the application environment, such as the voltage and temperature range, the power consumption, and the power dissipation.
Case studies can also be used to evaluate the performance and reliability of the XC4085XLA-07BG560C chip model. These case studies should include the performance of the chip model in different applications and the reliability of the chip model in different environments. This will help to determine whether the chip model is suitable for the application environment.
Finally, when considering the XC4085XLA-07BG560C chip model, it is important to consider the safety and reliability of the chip model. This includes the safety and reliability of the chip model in the application environment, as well as the safety and reliability of the chip model in the manufacturing process. It is also important to consider the safety and reliability of the chip model in the installation process.
In conclusion, the XC4085XLA-07BG560C chip model has a wide range of features and capabilities that make it suitable for a variety of applications. Its low power consumption and high performance make it a cost-effective solution for many applications. Its design requirements should be carefully considered, and case studies should be used to evaluate its performance and reliability. Finally, it is important to consider the safety and reliability of the chip model in the application environment and the manufacturing process. Whether the application environment requires the support of new technologies depends on what specific technologies are needed.
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1,569 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $127.2240 | $127.2240 |
| 10+ | $125.8560 | $1,258.5600 |
| 100+ | $119.0160 | $11,901.6000 |
| 1000+ | $112.1760 | $56,088.0000 |
| 10000+ | $102.6000 | $102,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||