AMD Xilinx
XC4085XL-3BGG560C
XC4085XL-3BGG560C ECAD Model
XC4085XL-3BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | MAX USABLE 85000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XL-3BGG560C Datasheet Download
XC4085XL-3BGG560C Overview
The XC4085XL-3BGG560C chip model is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, image processing and other related applications. It is designed to be used with hardware description language (HDL) and offers a number of advantages over other chip models.
The XC4085XL-3BGG560C chip model is designed to provide high-speed data processing, with a maximum clock rate of 560 MHz. It also features a large number of on-chip memory blocks, which can be used to store data and instructions. The chip model also includes an integrated programmable logic block, which can be used to customize the chip’s behavior.
The XC4085XL-3BGG560C chip model is designed to be highly efficient, consuming minimal power while still providing high performance. It also has a low gate count and requires minimal external components, making it ideal for applications where space and power are limited.
The XC4085XL-3BGG560C chip model is expected to see increasing demand in the coming years, as more applications require high-performance digital signal processing and embedded processing. The chip model is designed to be easily upgradable, allowing for future upgrades to keep up with the latest technologies.
The XC4085XL-3BGG560C chip model is also designed to be suitable for advanced communication systems, including wireless networks and the Internet of Things. The chip model is designed to be highly configurable, allowing for a wide range of applications.
In conclusion, the XC4085XL-3BGG560C chip model is designed to provide high-performance digital signal processing, embedded processing, image processing, and other related applications. It is designed to be highly efficient, and is expected to see increasing demand in the coming years. The chip model is also designed to be suitable for advanced communication systems, and is easily upgradable for future upgrades.
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2,813 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $504.8399 | $504.8399 |
| 10+ | $499.4115 | $4,994.1151 |
| 100+ | $472.2696 | $47,226.9582 |
| 1000+ | $445.1277 | $222,563.8260 |
| 10000+ | $407.1290 | $407,128.9500 |
| The price is for reference only, please refer to the actual quotation! | ||