AMD Xilinx
XC4062XLA-9BG352C
XC4062XLA-9BG352C ECAD Model
XC4062XLA-9BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-9BG352C Datasheet Download
XC4062XLA-9BG352C Overview
The chip model XC4062XLA-9BG352C is a product of Xilinx, Inc., a leading provider of programmable logic solutions. It is an advanced, low-power, high-performance field-programmable gate array (FPGA) designed for use in a wide range of applications, including digital signal processing, networking, embedded systems, and medical imaging. This chip model features an efficient architecture and a wide range of features, including high-speed transceivers, low-power logic, and high-performance DSP blocks.
The industry trends for the XC4062XLA-9BG352C chip model are constantly evolving. It is essential to keep up with the latest developments in order to make sure the chip model is suitable for the application environment. This chip model is suitable for use in a wide range of applications, including high-speed networking, embedded systems, and medical imaging. As the technology advances, it is necessary to ensure the chip model is compatible with new technologies, such as 5G, AI, and IoT.
In terms of the possible future applications of the XC4062XLA-9BG352C chip model, it can be used in networks to enable high-speed data transmission and to enable intelligent scenarios. It can also be used in the era of fully intelligent systems to enable intelligent decision-making and control. Furthermore, the chip model can be used to enable the development of autonomous vehicles, smart homes, and other intelligent applications.
The product description and specific design requirements of the XC4062XLA-9BG352C chip model include a wide range of features, including high-speed transceivers, low-power logic, and high-performance DSP blocks. It also features an efficient architecture and a wide range of I/O options, making it suitable for a wide range of applications. Furthermore, the chip model is designed to be compatible with a wide range of development tools and software, making it easy to integrate into existing systems.
The actual case studies and precautions for using the XC4062XLA-9BG352C chip model should be considered when using the chip model. It is important to ensure that the chip model is suitable for the application environment and that it is compatible with the latest technologies. Furthermore, it is important to ensure that the chip model is properly configured and tested before use. Additionally, it is important to ensure that the chip model is used in accordance with the manufacturer's instructions and safety guidelines.
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|---|---|---|
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