XC4062XLA-8HQ208C
XC4062XLA-8HQ208C
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rohs

AMD Xilinx

XC4062XLA-8HQ208C


XC4062XLA-8HQ208C
F20-XC4062XLA-8HQ208C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HFQFP
HFQFP

XC4062XLA-8HQ208C ECAD Model


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XC4062XLA-8HQ208C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Clock Frequency-Max 263 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code HFQFP
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description HFQFP,
Pin Count 208
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4062XLA-8HQ208C Datasheet Download


XC4062XLA-8HQ208C Overview



The chip model XC4062XLA-8HQ208C is a cutting-edge product in the semiconductor industry. It is designed to provide a wide range of features and functions that are suitable for a variety of applications. This chip model is designed to meet the needs of various industries, such as communication, automotive, consumer electronics, and medical.


The chip model XC4062XLA-8HQ208C is based on the latest technology, offering high-performance and low power consumption. It is also equipped with advanced features such as high-speed data processing, low latency, and high reliability. It is suitable for high-speed, low-latency, high-reliability applications. In addition, it is also suitable for applications that require ultra-low power consumption and high-speed data transmission.


In terms of industry trends, the chip model XC4062XLA-8HQ208C is expected to be widely used in the future. It is suitable for applications such as 5G networks, autonomous driving, and artificial intelligence (AI). It can be used in scenarios such as edge computing, network optimization, and network security. In addition, it is also suitable for applications such as smart home, smart city, and industrial Internet of Things (IoT).


The product description of the chip model XC4062XLA-8HQ208C includes a range of features and functions. It is designed to support communication protocols such as Ethernet, Wi-Fi, and Bluetooth. It is also designed to support the latest technologies such as 5G, AI, and edge computing. In addition, it is designed to support a wide range of applications such as automotive, consumer electronics, and medical.


In terms of design requirements, the chip model XC4062XLA-8HQ208C needs to meet certain criteria. It must be able to support the latest technologies, provide high-speed data processing, low latency, and high reliability. In addition, it must be able to support a wide range of applications and be able to work in harsh environments.


In terms of actual case studies, the chip model XC4062XLA-8HQ208C has been used in a variety of applications. For example, it has been used in the automotive industry for autonomous driving and in the medical industry for medical imaging. In addition, it has also been used in the consumer electronics industry for smart home and smart city applications.


Finally, when using the chip model XC4062XLA-8HQ208C, certain precautions should be taken. For example, it should be used in an environment that is suitable for its features and functions. In addition, it should be used in an environment that is free from electrical interference and extreme temperatures. Furthermore, it should be used in an environment where the power supply is stable and reliable.


In conclusion, the chip model XC4062XLA-8HQ208C is a cutting-edge product in the semiconductor industry. It is designed to provide a wide range of features and functions that are suitable for a variety of applications. In terms of industry trends, it is expected to be widely used in the future. In terms of design requirements, it must be able to support the latest technologies, provide high-speed data processing, low latency, and high reliability. In terms of actual case studies, it has been used in a variety of applications. Finally, when using the chip model XC4062XLA-8HQ208C, certain precautions should be taken.



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