AMD Xilinx
XC4062XLA-09HQ160C
XC4062XLA-09HQ160C ECAD Model
XC4062XLA-09HQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 129 | |
| Number of Outputs | 129 | |
| Number of Logic Cells | 5472 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQFP | |
| Package Equivalence Code | HQFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-09HQ160C Datasheet Download
XC4062XLA-09HQ160C Overview
The XC4062XLA-09HQ160C chip model is an advanced and powerful device designed for high-performance digital signal processing, embedded processing, and image processing. It is a very versatile chip model that is capable of performing a variety of tasks and it is programmed using the HDL language. This chip model is highly efficient and reliable and is expected to become a popular choice for many industries.
The XC4062XLA-09HQ160C chip model has many advantages over other chip models, including its high-performance capability, low power consumption, and low cost. It also offers a wide range of features and functions, making it an ideal choice for many applications. The chip model can also be used in a variety of scenarios, such as in networks, embedded systems, and image processing.
The XC4062XLA-09HQ160C chip model is expected to become increasingly popular in the future due to its many advantages. It is likely to be used in a variety of applications, including those related to networking, embedded systems, and image processing. It is also expected to be used in the era of fully intelligent systems, as it is capable of performing complex tasks and is highly reliable.
The XC4062XLA-09HQ160C chip model is an ideal choice for many applications, as it is highly efficient, reliable, and cost-effective. It is also expected to be used in a variety of intelligent scenarios, such as in networks and embedded systems. This chip model is expected to become increasingly popular in the future, as it is capable of performing complex tasks and is highly reliable. It is likely to be used in the era of fully intelligent systems, as it is capable of performing complex tasks and is highly reliable.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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