
AMD Xilinx
XC4062XLA-09BGG432C
XC4062XLA-09BGG432C ECAD Model
XC4062XLA-09BGG432C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | CAN ALSO USE 130000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 432 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4062XLA-09BGG432C Datasheet Download
XC4062XLA-09BGG432C Overview
The XC4062XLA-09BGG432C chip model is a highly advanced integrated circuit that has been designed for use in a wide range of applications. It is a multi-purpose chip that can be used in a variety of communication systems, from basic wireless networks to advanced communication systems. The chip model is capable of providing high speed data transmission and processing, making it ideal for a wide range of applications.
The XC4062XLA-09BGG432C chip model is designed to be highly efficient and reliable. It is capable of providing high speed data transmission and processing, making it ideal for a wide range of applications. This chip model is capable of providing high levels of performance, making it suitable for a variety of intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, making it an ideal choice for the development and popularization of future intelligent robots.
The XC4062XLA-09BGG432C chip model is designed to be highly efficient and reliable. It is capable of providing high speed data transmission and processing, making it ideal for a wide range of applications. It is also capable of being used in the era of fully intelligent systems, making it an ideal choice for the development and popularization of future intelligent robots. To use the chip model effectively, technical talents with knowledge of programming and hardware engineering are needed.
The XC4062XLA-09BGG432C chip model is designed with the intention of providing a reliable and efficient solution for a wide range of applications. It is capable of providing high speed data transmission and processing, making it ideal for a wide range of applications. It is also capable of being used in the era of fully intelligent systems, making it an ideal choice for the development and popularization of future intelligent robots. The chip model also has the potential to be upgraded in the future, making it a highly versatile and reliable solution for a wide range of applications. With the right technical talents, the XC4062XLA-09BGG432C chip model can be used to develop and popularize future intelligent robots, making it an invaluable tool for the future of technology.
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4,043 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $29.0160 | $29.0160 |
10+ | $28.7040 | $287.0400 |
100+ | $27.1440 | $2,714.4000 |
1000+ | $25.5840 | $12,792.0000 |
10000+ | $23.4000 | $23,400.0000 |
The price is for reference only, please refer to the actual quotation! |