AMD Xilinx
XC4062XLA-09BG560I
XC4062XLA-09BG560I ECAD Model
XC4062XLA-09BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-09BG560I Datasheet Download
XC4062XLA-09BG560I Overview
The XC4062XLA-09BG560I chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed with a hardware description language (HDL). This makes it an ideal choice for a variety of applications, from consumer goods to industrial applications.
The chip model offers a number of advantages, including high clock speed, low power consumption, and a wide range of peripheral support. Additionally, it provides the flexibility to easily adapt to changing demands and technologies. This makes it an attractive option for a variety of applications, from consumer goods to industrial applications.
The future demand trends for the XC4062XLA-09BG560I chip model in related industries will be largely determined by the specific technologies needed. For example, if new technologies such as artificial intelligence or machine learning are needed, the chip model may need to be adapted to support them. However, the chip model already offers a number of advantages, such as high clock speed, low power consumption, and a wide range of peripheral support, which should make it an attractive option for a variety of applications.
Overall, the chip model XC4062XLA-09BG560I is an excellent choice for a variety of applications, from consumer goods to industrial applications. It offers a number of advantages, including high clock speed, low power consumption, and a wide range of peripheral support. The future demand trends for the chip model in related industries will be largely determined by the specific technologies needed. However, the chip model already offers a number of advantages, which should make it an attractive option for a variety of applications.
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