AMD Xilinx
XC4062XLA-09BG560C
XC4062XLA-09BG560C ECAD Model
XC4062XLA-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, BGA-560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 560 |
XC4062XLA-09BG560C Datasheet Download
XC4062XLA-09BG560C Overview
The chip model XC4062XLA-09BG560C is an integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) language, making it ideal for those who need to create complex designs.
The chip model XC4062XLA-09BG560C is well-suited to the development of future intelligent robots, as it can be used to create sophisticated designs that can be used in robotics applications. In addition, the chip model is also suitable for applications that require the use of new technologies, such as artificial intelligence, machine learning, and natural language processing.
To effectively use the chip model XC4062XLA-09BG560C, technical knowledge in the areas of digital signal processing, embedded processing, and image processing is essential. Additionally, knowledge of HDL (Hardware Description Language) is also needed to create complex designs.
The chip model XC4062XLA-09BG560C is part of a larger trend in the industry towards more powerful and sophisticated integrated circuits. This trend is likely to continue in the future, as the demand for more powerful and efficient designs increases.
Overall, the chip model XC4062XLA-09BG560C is a powerful and versatile integrated circuit that is suitable for a variety of applications. Its ability to be used with the HDL language makes it an ideal choice for those who need to create complex designs, while its suitability for the development of future intelligent robots makes it a great choice for those looking to explore the possibilities of artificial intelligence and robotics. Technical knowledge in the areas of digital signal processing, embedded processing, and image processing, as well as familiarity with HDL, is essential for those who wish to use the chip model effectively.
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|---|---|---|
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