
AMD Xilinx
XC4062XLA-09BG432I
XC4062XLA-09BG432I ECAD Model
XC4062XLA-09BG432I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 2304 | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | CAN ALSO USE 130000 GATES | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA432,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-432 | |
Pin Count | 432 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4062XLA-09BG432I Datasheet Download
XC4062XLA-09BG432I Overview
The XC4062XLA-09BG432I chip model is a powerful, high-performance digital signal processor that is suitable for a wide range of applications, such as embedded processing, image processing, and more. It is designed to be used with HDL (Hardware Description Language) for further development and customization.
The XC4062XLA-09BG432I chip model offers a range of advantages, including low power consumption, high-speed processing, and a wide range of features. It also supports a variety of operating systems and can be integrated with other hardware components. The chip model is expected to be in high demand in the coming years in industries such as automotive, consumer electronics, medical, and industrial automation.
In terms of product design requirements, the XC4062XLA-09BG432I chip model is designed to be used with HDL language and requires a specific set of instructions to program it. It is important to understand the exact requirements of the chip model before designing a solution. Additionally, the chip model must be tested thoroughly to ensure that it meets the desired performance levels.
The XC4062XLA-09BG432I chip model has been used in a variety of applications, such as automotive, consumer electronics, medical, and industrial automation. In the automotive industry, the chip model has been used for advanced driver assistance systems (ADAS) and autonomous driving. In the consumer electronics industry, the chip model has been used for image processing and 3D printing. In the medical industry, the chip model has been used for medical imaging and diagnostics. In the industrial automation industry, the chip model has been used for machine vision and robotics.
When designing a solution with the XC4062XLA-09BG432I chip model, it is important to consider the specific requirements of the application and to ensure that the chip model is tested thoroughly. Additionally, it is important to take into account the power consumption and heat dissipation requirements of the chip model, as well as the compatibility of the chip model with other hardware components.
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1,469 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $29.0160 | $29.0160 |
10+ | $28.7040 | $287.0400 |
100+ | $27.1440 | $2,714.4000 |
1000+ | $25.5840 | $12,792.0000 |
10000+ | $23.4000 | $23,400.0000 |
The price is for reference only, please refer to the actual quotation! |