XC4062XLA-09BG432C
XC4062XLA-09BG432C
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rohs

AMD Xilinx

XC4062XLA-09BG432C


XC4062XLA-09BG432C
F20-XC4062XLA-09BG432C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-432
PLASTIC, BGA-432

XC4062XLA-09BG432C ECAD Model


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XC4062XLA-09BG432C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 2304
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Additional Feature CAN ALSO USE 130000 GATES
Clock Frequency-Max 227 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA432,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-432
Pin Count 432
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4062XLA-09BG432C Datasheet Download


XC4062XLA-09BG432C Overview



The XC4062XLA-09BG432C chip model is a high-performance integrated circuit (IC) designed by Xilinx, Inc. It is a single-chip solution for a wide range of applications, including communications, industrial automation, aerospace and defense, and medical electronics. This model is designed to provide increased performance, lower power consumption, and improved reliability. It is also designed to be compatible with the latest communication systems and technologies.


The XC4062XLA-09BG432C chip model offers a number of advantages over its predecessors. It has a higher operating frequency, which allows for faster communication speeds. It also has a lower power consumption, which helps to reduce energy costs. Additionally, the chip model is designed to be more reliable than other ICs, making it a reliable choice for applications that require a high level of performance.


The XC4062XLA-09BG432C chip model is expected to be in high demand in the future, as it is a versatile and reliable IC. It is expected to be used in a variety of applications, from industrial automation to aerospace and defense. Additionally, the chip model is designed to be compatible with the latest communication systems and technologies, making it a great choice for those looking to upgrade their systems.


The original design intention of the XC4062XLA-09BG432C chip model was to provide a reliable and efficient solution for a wide range of applications. It has been designed to be compatible with the latest communication systems and technologies, making it a great choice for those looking to upgrade their systems. It is also expected to be upgradable in the future, allowing for improved performance and reliability.


In conclusion, the XC4062XLA-09BG432C chip model is a high-performance IC designed by Xilinx, Inc. It offers a number of advantages, such as increased performance, lower power consumption, and improved reliability. It is expected to be in high demand in the future, as it is a versatile and reliable IC. Additionally, the chip model is designed to be compatible with the latest communication systems and technologies, making it a great choice for those looking to upgrade their systems. It is also expected to be upgradable in the future, allowing for improved performance and reliability.



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Unit Price: $31.20
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Pricing (USD)

QTY Unit Price Ext Price
1+ $29.0160 $29.0160
10+ $28.7040 $287.0400
100+ $27.1440 $2,714.4000
1000+ $25.5840 $12,792.0000
10000+ $23.4000 $23,400.0000
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