AMD Xilinx
XC4062XLA-09BG352I
XC4062XLA-09BG352I ECAD Model
XC4062XLA-09BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5472 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-09BG352I Datasheet Download
XC4062XLA-09BG352I Overview
The XC4062XLA-09BG352I is a highly advanced chip model designed for high-performance digital signal processing, embedded processing, and image processing. The chip is designed with the HDL language for programming, which is a hardware description language used for designing, simulating, and verifying digital logic circuits.
The chip model XC4062XLA-09BG352I is a versatile product that can be used for a variety of applications. It can be used for digital signal processing, embedded processing, image processing, and other related applications. It is a highly reliable and efficient product that can provide users with the highest level of performance.
The XC4062XLA-09BG352I is a cutting-edge chip model that is designed to meet the changing needs of the industry. With the rapid development of technology, the chip model is designed to keep up with the latest trends and technologies. It is designed to provide users with the most up-to-date features and capabilities.
The product description and specific design requirements of the chip model XC4062XLA-09BG352I are available on the manufacturer's website. It includes the product specifications, power requirements, and programming instructions. In addition, the manufacturer also provides actual case studies and precautions that can help users understand the product better and use it more effectively.
The chip model XC4062XLA-09BG352I is an advanced product that can provide users with high-performance digital signal processing, embedded processing, and image processing. It is designed to keep up with the latest industry trends and technologies, and it is designed to meet the changing needs of the industry. With the product description and specific design requirements available on the manufacturer's website, users can understand the product better and use it more effectively.
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| QTY | Unit Price | Ext Price |
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