AMD Xilinx
XC4062XLA-09BG352C
XC4062XLA-09BG352C ECAD Model
XC4062XLA-09BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5472 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-09BG352C Datasheet Download
XC4062XLA-09BG352C Overview
The XC4062XLA-09BG352C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which makes it a powerful choice for many applications. This chip model can be used in many industries, such as automotive, healthcare, and communications.
The XC4062XLA-09BG352C chip model is a great choice for those who need to develop and popularize future intelligent robots. It is powerful enough to handle many complex tasks, and the HDL language makes it easy to program. The chip model is also able to support new technologies, such as machine learning and artificial intelligence, which are becoming increasingly important in the development of robots.
In order to use the XC4062XLA-09BG352C chip model effectively, technical talents such as software engineers and hardware engineers are needed. These professionals should have a comprehensive understanding of the chip model, as well as the ability to use the HDL language. They should also have a good understanding of the technologies needed to develop and popularize intelligent robots, such as machine learning and artificial intelligence.
The XC4062XLA-09BG352C chip model is a powerful tool that can be used in many industries. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. With the help of the HDL language, the chip model can be used to develop and popularize future intelligent robots. Technical talents such as software engineers and hardware engineers are needed to use the chip model effectively, and they should have a good understanding of the technologies needed to do so.
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