AMD Xilinx
XC4062XLA-08BG560I
XC4062XLA-08BG560I ECAD Model
XC4062XLA-08BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-08BG560I Datasheet Download
XC4062XLA-08BG560I Overview
The XC4062XLA-08BG560I chip model is a state-of-the-art semiconductor device that is designed to provide a high level of performance and reliability for a wide range of applications. It is a highly integrated, low-power, low-cost, and high-performance 8-bit microcontroller that is suitable for a variety of applications, such as embedded systems, industrial automation, and consumer electronics.
In terms of industry trends, the XC4062XLA-08BG560I chip model is expected to be widely adopted in the near future. Its low power consumption and high performance make it a great choice for the Internet of Things (IoT) and other smart applications. It is also suitable for use in various embedded systems, such as automotive, medical, and consumer electronics. The model is also expected to be used in various networks and intelligent scenarios, such as home automation, security systems, and industrial automation.
The XC4062XLA-08BG560I chip model has several advantages that make it a great choice for a wide range of applications. It has a small footprint, low power consumption, and high performance, which allows it to be used in a variety of applications. Additionally, it has a wide range of peripherals, including timers, serial ports, and analog-to-digital converters, which makes it suitable for a variety of applications.
In terms of future development, the XC4062XLA-08BG560I chip model is expected to be used in a variety of new applications. As the demand for intelligent systems grows, the model is expected to be used in a variety of intelligent scenarios, such as home automation, security systems, and industrial automation. Additionally, as the demand for high-performance and low-power solutions increases, the model is expected to be used in a variety of networks, such as 5G networks, industrial networks, and the Internet of Things (IoT).
The XC4062XLA-08BG560I chip model is a great choice for a variety of applications due to its low power consumption, high performance, and wide range of peripherals. Its expected use in a variety of networks and intelligent scenarios makes it a great choice for the future of the industry. Whether the application environment requires the support of new technologies depends on what specific technologies are needed, but the XC4062XLA-08BG560I chip model is expected to be a great choice for a variety of applications in the near future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||