AMD Xilinx
XC4062XLA-08BG560C
XC4062XLA-08BG560C ECAD Model
XC4062XLA-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-08BG560C Datasheet Download
XC4062XLA-08BG560C Overview
The XC4062XLA-08BG560C chip model is a high-performance digital signal processor that is suitable for embedded processing, image processing, and other related applications. It is a field-programmable gate array (FPGA) that requires the use of HDL language to program its functions. It is a powerful tool for engineers and designers who need to create complex and high-performance systems.
The XC4062XLA-08BG560C chip model is designed to be used in a wide variety of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to provide high-performance and reliable operation in a wide range of environments. It is also designed to be easy to use and program, making it ideal for engineers and designers who need to quickly and accurately create complex systems.
The XC4062XLA-08BG560C chip model is designed to be flexible and powerful, allowing engineers and designers to create a wide range of systems. It is also designed to be cost-effective, providing a reliable and cost-effective solution for a wide range of applications. It is also designed to be easy to use, allowing engineers and designers to quickly and accurately create complex systems.
The XC4062XLA-08BG560C chip model is designed to be used in a wide variety of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to provide high-performance and reliable operation in a wide range of environments. It is also designed to be easy to use and program, making it ideal for engineers and designers who need to quickly and accurately create complex systems.
The XC4062XLA-08BG560C chip model is also designed to be compatible with a wide range of technologies, allowing engineers and designers to easily integrate the chip into existing systems. It is also designed to be flexible, allowing engineers and designers to easily modify the chip to meet their specific needs.
The XC4062XLA-08BG560C chip model is designed to be used in a wide variety of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to provide high-performance and reliable operation in a wide range of environments. It is also designed to be easy to use and program, making it ideal for engineers and designers who need to quickly and accurately create complex systems.
When it comes to the industry trends of the XC4062XLA-08BG560C chip model and the future development of related industries, it largely depends on what specific technologies are needed and what the application environment requires. In order to ensure that the chip model is used correctly and effectively, it is important to understand the product description and specific design requirements of the chip model, as well as any actual case studies and precautions that may be necessary. This will help engineers and designers to create a system that is reliable and cost-effective, while also meeting their specific needs.
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1,767 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $46.5000 | $46.5000 |
| 10+ | $46.0000 | $460.0000 |
| 100+ | $43.5000 | $4,350.0000 |
| 1000+ | $41.0000 | $20,500.0000 |
| 10000+ | $37.5000 | $37,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||