AMD Xilinx
XC4062XLA-08BG432C
XC4062XLA-08BG432C ECAD Model
XC4062XLA-08BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-08BG432C Datasheet Download
XC4062XLA-08BG432C Overview
The XC4062XLA-08BG432C chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL language, a hardware description language, which allows for a high level of control over the chip’s architecture and design.
The original design intention of the XC4062XLA-08BG432C was to provide a powerful processor for a range of applications. It is designed to be highly versatile and able to cope with a variety of tasks, from image processing to embedded processing. It is also capable of being upgraded in the future, allowing it to remain up-to-date with the latest technologies.
The XC4062XLA-08BG432C chip model is highly suitable for use in advanced communication systems. It is capable of being used in networks, allowing it to transfer data quickly and efficiently. It is also capable of being used in intelligent scenarios, providing the necessary processing power to enable advanced machine learning algorithms.
As the world moves towards a fully intelligent future, the XC4062XLA-08BG432C chip model will be an invaluable asset. It is capable of providing the necessary processing power to enable a range of intelligent applications, from autonomous vehicles to smart home systems. It is also capable of being upgraded in the future, ensuring that it can keep up with the latest developments in the field of artificial intelligence.
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4,539 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $56.6616 | $56.6616 |
| 10+ | $56.0523 | $560.5229 |
| 100+ | $53.0060 | $5,300.5968 |
| 1000+ | $49.9596 | $24,979.8240 |
| 10000+ | $45.6948 | $45,694.8000 |
| The price is for reference only, please refer to the actual quotation! | ||