AMD Xilinx
XC4062XLA-07HQ304C
XC4062XLA-07HQ304C ECAD Model
XC4062XLA-07HQ304C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G304 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 304 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP304,1.7SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 4.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-304 | |
| Pin Count | 304 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-07HQ304C Datasheet Download
XC4062XLA-07HQ304C Overview
The XC4062XLA-07HQ304C chip model is a popular choice for many industries, as it offers a wide range of features and benefits. It is a type of microcontroller that is used in a variety of applications, ranging from consumer electronics to industrial automation. It is an integrated circuit (IC) that combines a processor core, memory, and input/output (I/O) peripherals on a single chip.
The XC4062XLA-07HQ304C chip model is designed to support a wide range of technologies, such as wireless communication, Bluetooth, and Zigbee. It is also compatible with a variety of operating systems, including Windows, Linux, and Android. It also supports a wide range of communication protocols, including USB, Ethernet, and Wi-Fi.
The XC4062XLA-07HQ304C chip model is designed to be highly reliable and efficient. It is designed to be robust and able to handle a variety of tasks. It is also designed to be power-efficient, allowing it to run for long periods of time without needing to be recharged. It also features low power consumption, making it ideal for battery-powered applications.
When considering the industry trends of the XC4062XLA-07HQ304C chip model and the future development of related industries, it is important to consider what specific technologies are needed. It is also important to consider the original design intention of the chip model and the possibility of future upgrades. Additionally, it is important to consider the product description and specific design requirements of the chip model, along with actual case studies and precautions.
When considering the application environment, it is important to consider the type of technology that is needed. For example, if the application requires wireless communication, then the XC4062XLA-07HQ304C chip model would be a good choice. It is also important to consider whether the application requires the support of new technologies, such as Bluetooth or Zigbee. Additionally, it is important to consider whether the application requires advanced communication systems, such as USB, Ethernet, or Wi-Fi.
Overall, the XC4062XLA-07HQ304C chip model is a popular choice for many industries due to its wide range of features and benefits. It is designed to be reliable, efficient, and power-efficient, making it ideal for a variety of applications. When considering the industry trends and future development of related industries, it is important to consider what specific technologies are needed, the original design intention of the chip model, and the product description and specific design requirements. Additionally, it is important to consider whether the application environment requires the support of new technologies, such as Bluetooth or Zigbee, or advanced communication systems, such as USB, Ethernet, or Wi-Fi.
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2,245 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $757.0349 | $757.0349 |
| 10+ | $748.8947 | $7,488.9472 |
| 100+ | $708.1939 | $70,819.3920 |
| 1000+ | $667.4931 | $333,746.5600 |
| 10000+ | $610.5120 | $610,512.0000 |
| The price is for reference only, please refer to the actual quotation! | ||