AMD Xilinx
XC4062XLA-07BGG432C
XC4062XLA-07BGG432C ECAD Model
XC4062XLA-07BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-07BGG432C Datasheet Download
XC4062XLA-07BGG432C Overview
The XC4062XLA-07BGG432C is a powerful and versatile chip model designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. This chip model is based on HDL (Hardware Description Language) technology, which enables it to be programmed and configured for different purposes.
The XC4062XLA-07BGG432C offers several advantages, such as high processing speed, low power consumption, and high reliability. These features make it suitable for a variety of applications, from consumer electronics to industrial automation. Furthermore, the chip model is designed to be easily upgradeable, allowing users to add new features and improve its performance as needed.
The XC4062XLA-07BGG432C is expected to become increasingly popular in the future, as its features and capabilities are well-suited to a wide range of applications. This chip model is also capable of being used in advanced communication systems, such as 5G networks, making it a great choice for businesses looking to upgrade their communication infrastructure.
The XC4062XLA-07BGG432C is a powerful and reliable chip model that is suitable for a variety of applications. Its features and capabilities make it suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. Furthermore, its design allows for easy upgrades, making it a great choice for businesses looking to upgrade their communication infrastructure. With its increasing popularity, the XC4062XLA-07BGG432C is sure to become a popular choice for businesses in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||