AMD Xilinx
XC4062XLA-07BG432C
XC4062XLA-07BG432C ECAD Model
XC4062XLA-07BG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XLA-07BG432C Datasheet Download
XC4062XLA-07BG432C Overview
The XC4062XLA-07BG432C chip model is a high-performance digital signal processing, embedded processing, and image processing solution. It provides a powerful platform for users to develop and implement their projects. The chip model is designed to be used with HDL, a hardware description language, allowing users to create sophisticated hardware designs.
The product description of the XC4062XLA-07BG432C chip model includes a wide range of features and specifications. It has a 32-bit RISC processor core, which is capable of executing instructions in a single clock cycle. It also contains an array of peripherals, such as a UART, SPI, I2C, and GPIO. Additionally, the chip model has a wide range of memory options, such as SRAM, ROM, and Flash.
The design of the XC4062XLA-07BG432C chip model is flexible and allows for a variety of projects to be developed. For example, it can be used to create a digital signal processor, an embedded processor, or an image processor. The chip model also includes a variety of tools and libraries, such as a C compiler, an assembler, and a debugger, which makes it easier to develop and test projects.
Case studies of the XC4062XLA-07BG432C chip model can be found in various industries. For example, it has been used to create a digital signal processor for a medical imaging system, an embedded processor for an industrial control system, and an image processor for a surveillance system. These case studies demonstrate the versatility and power of the chip model.
When using the XC4062XLA-07BG432C chip model, it is important to take certain precautions. For example, it is important to ensure that the design is optimized for the target application, and that the tools and libraries are properly configured. Additionally, it is important to ensure that the design meets all safety and security requirements.
The XC4062XLA-07BG432C chip model can be used to develop and popularize future intelligent robots. The chip model has the power and flexibility to create sophisticated hardware designs, and the tools and libraries to develop and test projects. To use the model effectively, technical talents such as software engineers, hardware engineers, and embedded system designers are required.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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