AMD Xilinx
XC4062XLA-07BG352C
XC4062XLA-07BG352C ECAD Model
XC4062XLA-07BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5472 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | CAN ALSO USE 130000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, BGA-352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 352 |
XC4062XLA-07BG352C Datasheet Download
XC4062XLA-07BG352C Overview
The XC4062XLA-07BG352C chip model is a high-performance digital signal processor (DSP) designed to handle complex embedded processing, image processing, and other operations. It utilizes the HDL (Hardware Description Language) language, allowing users to customize their applications to meet their specific needs.
The chip model XC4062XLA-07BG352C is designed to meet the demands of the latest industry trends, allowing for future upgrades and modifications. It is capable of being used in advanced communication systems, allowing for a wide range of applications.
The original design intention of the XC4062XLA-07BG352C was to provide users with a powerful and efficient means of processing digital signals, allowing for faster and more accurate results. Furthermore, the chip model is designed to be compatible with the latest technologies, such as 5G, IoT, and AI, making it an ideal choice for users looking to stay ahead of the curve.
The future development of related industries, such as communications, will require the use of new technologies, and the XC4062XLA-07BG352C is designed to be able to handle these new technologies. Furthermore, the chip model can be upgraded to support future technologies, allowing users to keep up with the latest industry trends.
In conclusion, the XC4062XLA-07BG352C chip model is an ideal choice for users looking for a powerful and efficient digital signal processor. It is designed to be compatible with the latest technologies, allowing users to stay ahead of the curve. Furthermore, the chip model is designed to be upgradable, allowing users to keep up with the latest industry trends and advancements.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||