AMD Xilinx
XC4062XL-3BGG432C
XC4062XL-3BGG432C ECAD Model
XC4062XL-3BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | MAX USABLE 62000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XL-3BGG432C Datasheet Download
XC4062XL-3BGG432C Overview
The XC4062XL-3BGG432C chip model is a high-performance digital signal processor that is designed for a wide range of applications. It is capable of handling complex tasks such as embedded processing, image processing, and other high-performance digital signal processing tasks. The chip model is designed to be used with a high-level HDL (Hardware Description Language) and offers flexibility, scalability, and reliability.
The original design intention of the XC4062XL-3BGG432C chip model was to provide a powerful, reliable, and cost-effective solution for a variety of applications. It was also designed to be easily upgradable and is capable of being used in a variety of advanced communication systems. This chip model is ideal for use in networks, as it is capable of handling complex tasks and providing reliable performance.
The XC4062XL-3BGG432C chip model can also be used in the era of fully intelligent systems. It is capable of handling complex tasks such as image processing, machine learning, and other intelligent scenarios. This chip model is capable of providing reliable performance and is ideal for use in intelligent systems. It is also capable of being used in advanced communication systems, as it is capable of handling complex tasks and providing reliable performance.
The XC4062XL-3BGG432C chip model is a powerful, reliable, and cost-effective solution for a variety of applications. It is capable of handling complex tasks and providing reliable performance, making it ideal for use in networks, intelligent systems, and advanced communication systems. It is also capable of being easily upgradable and is capable of being used in the era of fully intelligent systems. This chip model is an excellent choice for those looking for a powerful, reliable, and cost-effective solution for their digital signal processing needs.
You May Also Be Interested In
5,342 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $160.6369 | $160.6369 |
| 10+ | $158.9096 | $1,589.0958 |
| 100+ | $150.2732 | $15,027.3186 |
| 1000+ | $141.6368 | $70,818.3980 |
| 10000+ | $129.5459 | $129,545.8500 |
| The price is for reference only, please refer to the actual quotation! | ||