AMD Xilinx
XC4062XL-08HQ240C
XC4062XL-08HQ240C ECAD Model
XC4062XL-08HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 2304 | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | TYPICAL GATES = 40000-130000 | |
| Clock Frequency-Max | 238 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4062XL-08HQ240C Datasheet Download
XC4062XL-08HQ240C Overview
The chip model XC4062XL-08HQ240C is a high-performance, low-power integrated circuit developed by Xilinx, Inc. It is a member of the Xilinx FPGA family and is designed to provide advanced communication systems with a high level of performance, flexibility, and scalability.
The XC4062XL-08HQ240C has been designed with the intention of providing a low-cost, low-power solution for advanced communication systems. It is capable of providing high-speed data transfer, high-speed signal processing, and high-density memory. It also offers a wide range of features and functions, such as high-speed I/O, high-density memory, and high-speed signal processing. Additionally, the XC4062XL-08HQ240C is also capable of providing advanced features such as clock synchronization, data encryption, and advanced error correction.
The XC4062XL-08HQ240C is a highly flexible and scalable chip model that can be used in a variety of applications. It is suitable for use in a wide range of communication systems, including high-speed wireless networks, network security, and data transmission. Additionally, it can also be used in the development and popularization of future intelligent robots.
In order to design and implement the XC4062XL-08HQ240C effectively, it is necessary to have a good understanding of the chip model’s design principles and features. It is also important to understand the necessary precautions that must be taken when using the chip model. Additionally, it is important to be familiar with the technical talents and skills necessary to use the model effectively.
The XC4062XL-08HQ240C is a highly versatile and powerful chip model that can be used in a variety of applications. It is capable of providing advanced communication systems with a high level of performance, flexibility, and scalability. Additionally, it can also be used in the development and popularization of future intelligent robots. With the right knowledge and skills, the XC4062XL-08HQ240C can be used to its full potential, and can be upgraded in the future to meet new requirements.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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