
AMD Xilinx
XC4052XLA-09BGG432I
XC4052XLA-09BGG432I ECAD Model
XC4052XLA-09BGG432I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 33000 | |
Number of CLBs | 1936 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1936 CLBS, 33000 GATES | |
Additional Feature | CAN ALSO USE 100000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 432 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4052XLA-09BGG432I Datasheet Download
XC4052XLA-09BGG432I Overview
The chip model XC4052XLA-09BGG432I is a cutting-edge technology that has been developed to meet the needs of the ever-evolving technology industry. It is a powerful and versatile chip model that can be used in a wide variety of applications. With its advanced features and capabilities, XC4052XLA-09BGG432I is becoming increasingly popular in the industry.
The XC4052XLA-09BGG432I chip model is designed to meet the needs of the most demanding applications. It features a high-performance processor and a wide range of peripherals, making it an ideal choice for a wide range of applications such as embedded systems, consumer electronics, industrial automation, and automotive applications. The chip model also offers a wide range of interfaces, including USB, CAN, UART, and Ethernet, which makes it compatible with a variety of devices.
The XC4052XLA-09BGG432I chip model is designed to provide a high degree of flexibility and scalability, making it an ideal choice for the development and popularization of future intelligent robots. The chip model is capable of providing the necessary support for the development of advanced technologies such as machine learning, artificial intelligence, and natural language processing. It also provides the necessary support for the development of advanced algorithms and the integration of sensors and actuators.
Furthermore, the XC4052XLA-09BGG432I chip model is designed to be user-friendly and easy to use. It is designed to be compatible with a variety of development tools and platforms, making it easy for developers and engineers to use the model effectively. In addition, the chip model is designed to be highly reliable and durable, making it suitable for use in a wide range of environments.
In order to effectively use the XC4052XLA-09BGG432I chip model, it is important to have a good understanding of the industry trends, the development of related industries, and the application environment. It is also important to have a good understanding of the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Furthermore, it is important to have the necessary technical talents and skills to effectively use the model.
Overall, the XC4052XLA-09BGG432I chip model is an advanced and powerful chip model that can be used in a wide variety of applications. It is designed to provide a high degree of flexibility and scalability, making it an ideal choice for the development and popularization of future intelligent robots. In order to effectively use the model, it is important to have a good understanding of the industry trends, the development of related industries, and the application environment, as well as the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Furthermore, it is important to have the necessary technical talents and skills to effectively use the model.
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QTY | Unit Price | Ext Price |
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