XC4052XLA-09BGG432I
XC4052XLA-09BGG432I
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rohs

AMD Xilinx

XC4052XLA-09BGG432I


XC4052XLA-09BGG432I
F20-XC4052XLA-09BGG432I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XC4052XLA-09BGG432I ECAD Model


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XC4052XLA-09BGG432I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 33000
Number of CLBs 1936
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1936 CLBS, 33000 GATES
Additional Feature CAN ALSO USE 100000 GATES
Clock Frequency-Max 227 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 432
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC4052XLA-09BGG432I Datasheet Download


XC4052XLA-09BGG432I Overview



The chip model XC4052XLA-09BGG432I is a cutting-edge technology that has been developed to meet the needs of the ever-evolving technology industry. It is a powerful and versatile chip model that can be used in a wide variety of applications. With its advanced features and capabilities, XC4052XLA-09BGG432I is becoming increasingly popular in the industry.


The XC4052XLA-09BGG432I chip model is designed to meet the needs of the most demanding applications. It features a high-performance processor and a wide range of peripherals, making it an ideal choice for a wide range of applications such as embedded systems, consumer electronics, industrial automation, and automotive applications. The chip model also offers a wide range of interfaces, including USB, CAN, UART, and Ethernet, which makes it compatible with a variety of devices.


The XC4052XLA-09BGG432I chip model is designed to provide a high degree of flexibility and scalability, making it an ideal choice for the development and popularization of future intelligent robots. The chip model is capable of providing the necessary support for the development of advanced technologies such as machine learning, artificial intelligence, and natural language processing. It also provides the necessary support for the development of advanced algorithms and the integration of sensors and actuators.


Furthermore, the XC4052XLA-09BGG432I chip model is designed to be user-friendly and easy to use. It is designed to be compatible with a variety of development tools and platforms, making it easy for developers and engineers to use the model effectively. In addition, the chip model is designed to be highly reliable and durable, making it suitable for use in a wide range of environments.


In order to effectively use the XC4052XLA-09BGG432I chip model, it is important to have a good understanding of the industry trends, the development of related industries, and the application environment. It is also important to have a good understanding of the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Furthermore, it is important to have the necessary technical talents and skills to effectively use the model.


Overall, the XC4052XLA-09BGG432I chip model is an advanced and powerful chip model that can be used in a wide variety of applications. It is designed to provide a high degree of flexibility and scalability, making it an ideal choice for the development and popularization of future intelligent robots. In order to effectively use the model, it is important to have a good understanding of the industry trends, the development of related industries, and the application environment, as well as the product description and specific design requirements of the chip model, as well as actual case studies and precautions. Furthermore, it is important to have the necessary technical talents and skills to effectively use the model.



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