AMD Xilinx
XC4052XLA-09BGG432C
XC4052XLA-09BGG432C ECAD Model
XC4052XLA-09BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-09BGG432C Datasheet Download
XC4052XLA-09BGG432C Overview
The chip model XC4052XLA-09BGG432C is a new model of chip that has been released onto the market in recent years. It is a highly advanced and powerful chip that has been designed with the latest technologies to provide users with an efficient and reliable performance. The chip model is designed to meet the needs of a wide range of industries, including computing, networking, and communications. It is capable of providing users with a high level of performance and reliability while also being energy efficient and cost-effective.
The chip model XC4052XLA-09BGG432C has a number of advantages over other chip models on the market. It is highly efficient and reliable, with a low power consumption rate and a high level of performance. It is also designed to be compatible with a wide range of technologies and applications, making it suitable for a variety of uses. Additionally, the chip model is highly scalable, allowing it to be used in a variety of networks and applications.
The chip model XC4052XLA-09BGG432C is expected to be in high demand in the future. As the world continues to become increasingly connected, the demand for high-performance and reliable chips will only increase. The chip model is expected to be used in a wide range of applications, including networks, communications, and computing. Additionally, it is expected to be used in the era of fully intelligent systems, as it is capable of providing users with a high level of performance and reliability while also being energy efficient and cost-effective.
The chip model XC4052XLA-09BGG432C is expected to be used in a variety of networks and applications in the future. It is expected to be used in intelligent scenarios, such as artificial intelligence and machine learning. Additionally, it is expected to be used in the era of fully intelligent systems, as it is capable of providing users with a high level of performance and reliability while also being energy efficient and cost-effective.
Overall, the chip model XC4052XLA-09BGG432C is an advanced and powerful chip that is designed to meet the needs of a wide range of industries. It is highly efficient and reliable, with a low power consumption rate and a high level of performance. It is also designed to be compatible with a wide range of technologies and applications, making it suitable for a variety of uses. Additionally, it is expected to be in high demand in the future, as the world continues to become increasingly connected and the demand for high-performance and reliable chips increases. It is expected to be used in a variety of networks and applications, including intelligent scenarios such as artificial intelligence and machine learning, as well as in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||