AMD Xilinx
XC4052XLA-09BG560I
XC4052XLA-09BG560I ECAD Model
XC4052XLA-09BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 352 | |
| Number of Outputs | 352 | |
| Number of Logic Cells | 1936 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 |
XC4052XLA-09BG560I Datasheet Download
XC4052XLA-09BG560I Overview
The XC4052XLA-09BG560I chip model is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed to be compatible with the HDL language, making it an ideal choice for developers looking for a powerful and versatile chip. The original design intention of the chip was to provide a reliable and robust solution for a wide range of tasks, with the possibility of future upgrades and improvements.
The XC4052XLA-09BG560I chip model is suitable for use in advanced communication systems, such as networks and intelligent scenarios. It is capable of handling a variety of tasks, from data transmission to image processing, making it an ideal choice for today's digital age. Furthermore, the chip has the potential to be used in the future, as fully intelligent systems become more commonplace. This chip has the potential to be a powerful tool in the development of intelligent machines and systems, allowing developers to leverage its capabilities to create powerful and innovative solutions.
The XC4052XLA-09BG560I chip model is a versatile and powerful processor, offering a range of features that make it ideal for a variety of applications. Its compatibility with the HDL language makes it an ideal choice for developers looking for a reliable and robust solution. Furthermore, its potential for future upgrades and improvements make it a great choice for developers looking to keep up with the ever-evolving digital landscape. With its potential for use in advanced communication systems and intelligent scenarios, the XC4052XLA-09BG560I chip model is a great choice for developers looking to create powerful and innovative solutions for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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