AMD Xilinx
XC4052XLA-09BG560C
XC4052XLA-09BG560C ECAD Model
XC4052XLA-09BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 352 | |
| Number of Outputs | 352 | |
| Number of Logic Cells | 1936 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-09BG560C Datasheet Download
XC4052XLA-09BG560C Overview
The XC4052XLA-09BG560C chip model is a powerful and advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) programming language, which makes it a great choice for those who need to develop complex and sophisticated applications.
The XC4052XLA-09BG560C chip model has several advantages that make it a great choice for a variety of applications. It has a high operating frequency, which is up to 560 MHz, and is capable of performing complex operations quickly and efficiently. Additionally, the chip model has low power consumption, which makes it ideal for applications that require long battery life. It also has a wide range of features such as a large memory capacity and high-speed data transfer.
The demand for the XC4052XLA-09BG560C chip model is expected to continue to grow as more applications are developed for it. As the chip model is used in more and more applications, it will become increasingly popular in a variety of industries, such as automotive, medical, and consumer electronics.
The XC4052XLA-09BG560C chip model can also be used in the development and popularization of future intelligent robots. This chip model is capable of performing complex operations quickly and efficiently, which makes it a great choice for robotics applications. Additionally, the chip model is capable of handling large amounts of data, which is essential for robots that need to process large amounts of information. To use the XC4052XLA-09BG560C chip model effectively, technical expertise in HDL programming is necessary. Those who have knowledge in this area will be able to create sophisticated and powerful applications for robots.
In conclusion, the XC4052XLA-09BG560C chip model is a powerful and advanced integrated circuit that is suitable for a variety of applications. It has a high operating frequency, low power consumption, and a wide range of features, which make it an ideal choice for those who need to develop complex and sophisticated applications. The demand for the chip model is expected to continue to grow, and it can also be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical expertise in HDL programming is necessary.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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