AMD Xilinx
XC4052XLA-09BG432I
XC4052XLA-09BG432I ECAD Model
XC4052XLA-09BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 352 | |
| Number of Outputs | 352 | |
| Number of Logic Cells | 1936 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-09BG432I Datasheet Download
XC4052XLA-09BG432I Overview
The chip model XC4052XLA-09BG432I is a versatile tool designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is a powerful and versatile language used for describing digital systems. The chip model XC4052XLA-09BG432I is capable of handling complex tasks quickly and accurately.
The industry trends of the chip model XC4052XLA-09BG432I and the future development of related industries depend on the specific technologies needed. As technology advances, the application environment may require the support of new technologies. This chip model is a great tool for those looking to stay ahead of the curve and have access to the latest and greatest technologies.
The chip model XC4052XLA-09BG432I can be applied to the development and popularization of future intelligent robots, as it has the necessary capabilities to handle complex tasks. Technical talents are needed to use the model effectively, as they will need to be familiar with the HDL language and the capabilities of the chip model. Those with experience in digital signal processing, embedded processing, image processing, and other related technologies will be well-suited to use the chip model.
Overall, the chip model XC4052XLA-09BG432I is a great tool for those looking to stay ahead of the curve and have access to the latest and greatest technologies. It can be applied to the development and popularization of future intelligent robots, and those with experience in digital signal processing, embedded processing, image processing, and other related technologies will be well-suited to use the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||