
AMD Xilinx
XC4052XLA-09BG352I
XC4052XLA-09BG352I ECAD Model
XC4052XLA-09BG352I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 4598 | |
Number of Equivalent Gates | 33000 | |
Number of CLBs | 1936 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1936 CLBS, 33000 GATES | |
Additional Feature | CAN ALSO USE 100000 GATES | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4052XLA-09BG352I Datasheet Download
XC4052XLA-09BG352I Overview
The chip model XC4052XLA-09BG352I has become an increasingly popular choice for many industries due to its low power consumption and high processing speed. It is a highly integrated device that can be used for various applications, from industrial automation to consumer electronics. As the industry trends continue to evolve, the chip model XC4052XLA-09BG352I is likely to be used in more applications in the near future.
One of the most exciting applications for the chip model XC4052XLA-09BG352I is in the field of network technology. It is capable of providing high-speed, low-latency connections between multiple devices, making it ideal for applications such as IoT networks. With the rise of 5G technology, the chip model XC4052XLA-09BG352I will be even more useful in providing lightning-fast connections between multiple devices.
The chip model XC4052XLA-09BG352I is also suitable for use in intelligent scenarios. It can be used to power robots and other intelligent systems, as well as to handle complex tasks such as natural language processing and computer vision. In the era of fully intelligent systems, the chip model XC4052XLA-09BG352I can be used to provide the necessary computing power for these systems.
In order to use the chip model XC4052XLA-09BG352I effectively, technical talents are needed to design and develop applications that will make use of its capabilities. These technical talents should have a strong understanding of the chip model, as well as the necessary programming skills to develop applications that will make use of its features. With the right technical expertise, the chip model XC4052XLA-09BG352I can be used to develop and popularize future intelligent robots and other intelligent systems.
In conclusion, the chip model XC4052XLA-09BG352I is a powerful and versatile device that can be used in a variety of applications, from networks to intelligent scenarios. As the industry trends continue to evolve, the chip model XC4052XLA-09BG352I will become even more useful in providing the necessary computing power for future intelligent systems. With the right technical expertise, the chip model XC4052XLA-09BG352I can be used to develop and popularize future intelligent robots and other intelligent systems.
You May Also Be Interested In
3,889 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |