
AMD Xilinx
XC4052XLA-09BG352C
XC4052XLA-09BG352C ECAD Model
XC4052XLA-09BG352C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 4598 | |
Number of Equivalent Gates | 33000 | |
Number of CLBs | 1936 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1936 CLBS, 33000 GATES | |
Additional Feature | CAN ALSO USE 100000 GATES | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4052XLA-09BG352C Datasheet Download
XC4052XLA-09BG352C Overview
The chip model XC4052XLA-09BG352C is an advanced integrated circuit (IC) designed for a wide range of applications. It is a highly integrated device that combines a variety of functions such as analog-to-digital conversion, digital-to-analog conversion, and signal processing. This chip model is suitable for applications in various fields such as automotive, industrial, medical, and consumer electronics.
In terms of the industry trends, the XC4052XLA-09BG352C chip model is increasingly being used in networks and intelligent scenarios. It is capable of running in the era of fully intelligent systems and can be used in applications such as autonomous driving, smart home, and industrial automation. The chip model is also capable of supporting new technologies such as artificial intelligence (AI), machine learning (ML), and 5G.
The product description of the XC4052XLA-09BG352C chip model includes features such as low power consumption, low noise, and high performance. It is designed to meet the specific needs of different applications, and the design requirements include the size, power supply, and the number of pins. The chip model also has various protection functions such as over-temperature protection, over-current protection, and short-circuit protection.
In order to better understand the application environment of the XC4052XLA-09BG352C chip model, there are several case studies available. These case studies provide detailed information about the different scenarios and applications in which the chip model can be used. Additionally, the case studies also provide information about the precautions that need to be taken when using the chip model.
In conclusion, the XC4052XLA-09BG352C chip model is a highly integrated device that is suitable for a wide range of applications. It is increasingly being used in networks and intelligent scenarios and is capable of supporting new technologies such as AI and ML. The product description of the chip model includes features such as low power consumption, low noise, and high performance. In order to better understand the application environment of the chip model, there are several case studies available that provide detailed information about the different scenarios and applications in which the chip model can be used.
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