XC4052XLA-09BG352C
XC4052XLA-09BG352C
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rohs

AMD Xilinx

XC4052XLA-09BG352C


XC4052XLA-09BG352C
F20-XC4052XLA-09BG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-352
PLASTIC, BGA-352

XC4052XLA-09BG352C ECAD Model


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XC4052XLA-09BG352C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 4598
Number of Equivalent Gates 33000
Number of CLBs 1936
Combinatorial Delay of a CLB-Max 1.1 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1936 CLBS, 33000 GATES
Additional Feature CAN ALSO USE 100000 GATES
Clock Frequency-Max 227 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-352
Pin Count 352
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4052XLA-09BG352C Datasheet Download


XC4052XLA-09BG352C Overview



The chip model XC4052XLA-09BG352C is an advanced integrated circuit (IC) designed for a wide range of applications. It is a highly integrated device that combines a variety of functions such as analog-to-digital conversion, digital-to-analog conversion, and signal processing. This chip model is suitable for applications in various fields such as automotive, industrial, medical, and consumer electronics.


In terms of the industry trends, the XC4052XLA-09BG352C chip model is increasingly being used in networks and intelligent scenarios. It is capable of running in the era of fully intelligent systems and can be used in applications such as autonomous driving, smart home, and industrial automation. The chip model is also capable of supporting new technologies such as artificial intelligence (AI), machine learning (ML), and 5G.


The product description of the XC4052XLA-09BG352C chip model includes features such as low power consumption, low noise, and high performance. It is designed to meet the specific needs of different applications, and the design requirements include the size, power supply, and the number of pins. The chip model also has various protection functions such as over-temperature protection, over-current protection, and short-circuit protection.


In order to better understand the application environment of the XC4052XLA-09BG352C chip model, there are several case studies available. These case studies provide detailed information about the different scenarios and applications in which the chip model can be used. Additionally, the case studies also provide information about the precautions that need to be taken when using the chip model.


In conclusion, the XC4052XLA-09BG352C chip model is a highly integrated device that is suitable for a wide range of applications. It is increasingly being used in networks and intelligent scenarios and is capable of supporting new technologies such as AI and ML. The product description of the chip model includes features such as low power consumption, low noise, and high performance. In order to better understand the application environment of the chip model, there are several case studies available that provide detailed information about the different scenarios and applications in which the chip model can be used.



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