AMD Xilinx
XC4052XLA-08HQ160I
XC4052XLA-08HQ160I ECAD Model
XC4052XLA-08HQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 129 | |
| Number of Outputs | 129 | |
| Number of Logic Cells | 4598 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQFP | |
| Package Equivalence Code | HQFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-08HQ160I Datasheet Download
XC4052XLA-08HQ160I Overview
The XC4052XLA-08HQ160I chip model, developed by Xilinx, Inc., is an advanced, high-performance integrated circuit that can be applied to a wide range of modern communication systems. This chip model offers a unique combination of features, including a high-speed, low-power, 16-bit processor core, a wide range of peripherals, and an extensive range of memory options.
The XC4052XLA-08HQ160I chip model is designed to provide a comprehensive solution for modern communication systems, allowing users to easily and quickly build and deploy a wide range of applications and services. This chip model can be used to develop and deploy advanced communication systems, such as wireless networks, cellular networks, and other advanced communication systems.
The XC4052XLA-08HQ160I chip model is also designed to be easily upgradable, allowing users to easily add new features and capabilities to their systems. This chip model can also be used to develop intelligent systems, such as facial recognition and voice recognition systems, as well as intelligent robots. The XC4052XLA-08HQ160I chip model is also designed to be used in the era of fully intelligent systems, allowing users to develop and deploy intelligent systems that can interact with humans and each other.
In order to effectively use the XC4052XLA-08HQ160I chip model, users must be familiar with the chip model's architecture, programming language, and other technical aspects. In addition, users must have a good understanding of the chip model's capabilities and limitations, as well as the various communication protocols and technologies that can be used with the chip model. Furthermore, users must have the necessary technical skills and knowledge to be able to effectively use the chip model in order to develop and deploy intelligent systems.
You May Also Be Interested In
5,350 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||