AMD Xilinx
XC4052XLA-08HQ160C
XC4052XLA-08HQ160C ECAD Model
XC4052XLA-08HQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 129 | |
| Number of Outputs | 129 | |
| Number of Logic Cells | 4598 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQFP | |
| Package Equivalence Code | HQFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-08HQ160C Datasheet Download
XC4052XLA-08HQ160C Overview
The XC4052XLA-08HQ160C chip model is a high-performance model designed for digital signal processing, embedded processing, and image processing. It is a versatile chip that can be used to build powerful systems with a wide range of applications. The XC4052XLA-08HQ160C chip model offers a number of advantages that make it an attractive choice for many projects.
The XC4052XLA-08HQ160C chip model is designed to be used with the HDL language, which is a powerful and versatile language for designing digital systems. This language allows for the creation of complex systems that can be used for a variety of tasks, from data processing to image processing. The XC4052XLA-08HQ160C chip model also offers a number of other features, such as a high-performance processor, a wide range of peripherals, and a wide range of memory sizes.
The XC4052XLA-08HQ160C chip model is expected to be in high demand in the future. This is due to its versatility and the wide range of applications it can be used for. The chip model is also expected to be used in industries such as automotive, medical, and aerospace, where its capabilities can be used to create powerful systems.
The product description of the XC4052XLA-08HQ160C chip model includes a high-performance processor, a wide range of peripherals, and a wide range of memory sizes. The design requirements for the chip model include the use of HDL language, as well as a number of other features, such as a high-speed serial port, a wide range of analog and digital I/O, and a wide range of bus speeds.
There are a number of case studies that have been conducted with the XC4052XLA-08HQ160C chip model. These case studies have shown that the chip model is capable of creating powerful systems that can be used for a variety of tasks. In addition, these case studies have also shown that the chip model is reliable and can be used in a variety of environments.
When using the XC4052XLA-08HQ160C chip model, there are a few precautions that should be taken. It is important to ensure that the chip model is used in the correct environment and that all of the necessary components are present. In addition, it is important to ensure that the chip model is properly configured and that all of the necessary software and hardware are in place.
In conclusion, the XC4052XLA-08HQ160C chip model is a powerful and versatile chip model that can be used to build powerful systems with a wide range of applications. The chip model offers a number of advantages, such as a high-performance processor, a wide range of peripherals, and a wide range of memory sizes. In addition, the chip model is expected to be in high demand in the future due to its versatility and the wide range of applications it can be used for. Finally, it is important to ensure that the chip model is used in the correct environment and that all of the necessary components are present.
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