AMD Xilinx
XC4052XLA-08BG560C
XC4052XLA-08BG560C ECAD Model
XC4052XLA-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 352 | |
| Number of Outputs | 352 | |
| Number of Logic Cells | 1936 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-08BG560C Datasheet Download
XC4052XLA-08BG560C Overview
The chip model XC4052XLA-08BG560C is a highly advanced piece of technology that has been designed to meet the ever-evolving needs of the modern world. This chip can be used in a variety of applications, from networking to intelligent systems. It is designed to be a powerful tool for the development and popularization of future intelligent robots, and it is capable of supporting the latest technologies.
The industry trends of the chip model XC4052XLA-08BG560C are constantly changing, and the future development of related industries is highly dependent on the technologies that are required. The chip model XC4052XLA-08BG560C can be used in a variety of networks and intelligent scenarios, and it is capable of being used in the era of fully intelligent systems. It is also possible to apply the chip model to the development and popularization of future intelligent robots.
The chip model XC4052XLA-08BG560C requires the support of new technologies to be used effectively in the current application environment. It is important for users to have a good understanding of the latest technologies and the capabilities of the chip model. Technical talents are needed to use the chip model effectively, and this includes knowledge of the hardware and software components of the chip model, as well as the ability to troubleshoot any issues that may arise.
The chip model XC4052XLA-08BG560C is a powerful tool for the development and popularization of future intelligent robots, and it is capable of supporting the latest technologies. It is important for users to have a good understanding of the latest technologies and the capabilities of the chip model in order to use it effectively. With the right technical talents and knowledge, the chip model XC4052XLA-08BG560C can be used to create powerful and intelligent robots that can revolutionize the way we interact with the world.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||