AMD Xilinx
XC4052XLA-07BGG432C
XC4052XLA-07BGG432C ECAD Model
XC4052XLA-07BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-07BGG432C Datasheet Download
XC4052XLA-07BGG432C Overview
The chip model XC4052XLA-07BGG432C is a powerful and versatile semiconductor device that has been widely used in a variety of industrial applications. It has been developed to provide reliable, high-performance and cost-effective solutions to a variety of problems. It is also capable of supporting a wide range of communication protocols and is compatible with modern technologies such as Bluetooth, Wi-Fi, and GSM.
The XC4052XLA-07BGG432C chip model is designed to be highly scalable and upgradeable, allowing it to be used in a variety of different applications. This makes it an ideal choice for companies looking to expand their product range or to stay ahead of the competition. It is also capable of supporting the latest technologies in the industry, such as artificial intelligence, machine learning, and blockchain.
In terms of future development, the XC4052XLA-07BGG432C chip model is well positioned to be used in the development and popularization of future intelligent robots. This is due to its scalability, flexibility, and ability to support advanced communication protocols. It also requires a certain level of technical knowledge and expertise in order to be used effectively.
In conclusion, the XC4052XLA-07BGG432C chip model is a highly versatile and powerful semiconductor device that is capable of supporting a wide range of communication protocols and technologies. It is also capable of being upgraded and scaled to meet the needs of different applications. Additionally, it is well suited for the development and popularization of future intelligent robots, although it requires a certain level of technical knowledge and expertise in order to be used effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||