AMD Xilinx
XC4052XLA-07BG560C
XC4052XLA-07BG560C ECAD Model
XC4052XLA-07BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 352 | |
| Number of Outputs | 352 | |
| Number of Logic Cells | 1936 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-07BG560C Datasheet Download
XC4052XLA-07BG560C Overview
The chip model XC4052XLA-07BG560C is a powerful and versatile integrated circuit that is becoming increasingly popular in a variety of industries. It is a product of Xilinx, one of the most renowned semiconductor companies in the world. This chip model is designed to be used in many different applications, ranging from embedded systems to communications and robotics. In addition, it is also capable of being used for high-speed data processing and signal processing.
The XC4052XLA-07BG560C chip model offers a number of advantages over other similar models. It has a high operating speed, low power consumption, and a wide range of functions and features. In addition, it is capable of being used in a variety of different applications, including but not limited to embedded systems, communications, and robotics. Furthermore, it is also capable of being used in high-speed data processing and signal processing.
The demand for the XC4052XLA-07BG560C chip model is expected to continue to increase in the future, as it is becoming increasingly popular in various industries. This is due to its wide range of features and functions, as well as its high operating speed and low power consumption. Furthermore, its ability to be used in a variety of different applications makes it a very attractive option for many companies.
The original design intention of the XC4052XLA-07BG560C chip model was to provide a powerful and versatile integrated circuit that could be used in a variety of different applications. This chip model has the potential to be upgraded and improved in the future, allowing it to be used in more advanced communication systems. In addition, it is also capable of being used for the development and popularization of future intelligent robots.
In order to use the XC4052XLA-07BG560C chip model effectively, technical talents with knowledge and experience in the fields of embedded systems, communications, and robotics are highly recommended. These professionals should have a good understanding of the chip model’s features and functions, as well as its potential for future upgrades and improvements. Furthermore, they should also be knowledgeable in the areas of high-speed data processing and signal processing.
Overall, the XC4052XLA-07BG560C chip model is a powerful and versatile integrated circuit that is becoming increasingly popular in a variety of industries. Its wide range of features and functions, as well as its high operating speed and low power consumption, make it an attractive option for many companies. Furthermore, its potential for future upgrades and improvements, as well as its ability to be used in the development and popularization of future intelligent robots, make it an even more attractive option. Technical talents with knowledge and experience in the fields of embedded systems, communications, and robotics are highly recommended in order to use the XC4052XLA-07BG560C chip model effectively.
You May Also Be Interested In
4,869 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||