AMD Xilinx
XC4052XLA-07BG352C
XC4052XLA-07BG352C ECAD Model
XC4052XLA-07BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 4598 | |
| Number of Equivalent Gates | 33000 | |
| Number of CLBs | 1936 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1936 CLBS, 33000 GATES | |
| Additional Feature | CAN ALSO USE 100000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4052XLA-07BG352C Datasheet Download
XC4052XLA-07BG352C Overview
The XC4052XLA-07BG352C chip model is a powerful and versatile chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is programmed using a HDL language, which is a high-level language that is used to program hardware. This allows for greater flexibility and control over the chip's operations.
The XC4052XLA-07BG352C chip model has several advantages. It has a high-performance architecture, which enables faster processing speeds, better energy efficiency, and more reliable operation. It also has a wide range of applications, making it suitable for a variety of use cases. Furthermore, it has a robust set of features, such as support for multiple clock sources, high-speed I/O, and multiple memory configurations.
The demand for the XC4052XLA-07BG352C chip model is expected to continue to grow in the future, as it provides a reliable, high-performance solution for a variety of applications. The chip model is also suitable for use in a range of industries, including automotive, aerospace, and medical. As the demand for more sophisticated solutions increases, the XC4052XLA-07BG352C chip model will be in high demand.
The application environment for the XC4052XLA-07BG352C chip model may require the support of new technologies in order to keep up with the evolving industry trends. For example, as the automotive industry moves towards autonomous driving, the chip model may need to support new technologies such as artificial intelligence and machine learning. Similarly, in the medical field, the chip model may need to support new technologies such as medical imaging and data analysis.
Overall, the XC4052XLA-07BG352C chip model is a powerful and versatile chip model that is suitable for a wide range of applications. It has a high-performance architecture, a wide range of features, and is suitable for use in a variety of industries. As the demand for more sophisticated solutions increases, the XC4052XLA-07BG352C chip model will be in high demand, and may require the support of new technologies in order to keep up with the evolving industry trends.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||