
AMD Xilinx
XC4044XLA-9HQ240C
XC4044XLA-9HQ240C ECAD Model
XC4044XLA-9HQ240C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 27000 | |
Number of CLBs | 1600 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1600 CLBS, 27000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | HFQFP, | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4044XLA-9HQ240C Datasheet Download
XC4044XLA-9HQ240C Overview
The XC4044XLA-9HQ240C chip model is an advanced integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used with the HDL language, which is a hardware description language used to program digital logic circuits. The chip model is capable of providing a wide range of features, including high-speed data processing, real-time control, and fast communication.
The original design intention of the chip model XC4044XLA-9HQ240C was to provide a powerful and reliable platform for digital signal processing, embedded processing, and image processing applications. It is designed to be highly efficient, with a low power consumption and a small footprint. It also has the potential to be upgraded in the future, allowing for more advanced features and capabilities.
The product description of the XC4044XLA-9HQ240C chip model states that it is designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, and it is capable of providing a wide range of features, including high-speed data processing, real-time control, and fast communication. Additionally, it is designed to be highly efficient, with a low power consumption and a small footprint.
In order to ensure the successful operation of the XC4044XLA-9HQ240C chip model, there are certain design requirements that must be met. These include the use of the HDL language, the use of a suitable development environment, and the selection of appropriate components. Additionally, the chip model should be tested thoroughly before being used in any application.
Case studies of the XC4044XLA-9HQ240C chip model have shown that it is capable of providing high-performance digital signal processing, embedded processing, and image processing capabilities. It has also been used in advanced communication systems, where it has been shown to provide reliable and efficient results.
In conclusion, the XC4044XLA-9HQ240C chip model is an advanced integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used with the HDL language, and it is capable of providing a wide range of features, including high-speed data processing, real-time control, and fast communication. Additionally, it has the potential to be upgraded in the future, allowing for more advanced features and capabilities. However, it is important to ensure that all design requirements are met and that the chip model is tested thoroughly before being used in any application.
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