
AMD Xilinx
XC4044XLA-9HQ160C
XC4044XLA-9HQ160C ECAD Model
XC4044XLA-9HQ160C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 27000 | |
Number of CLBs | 1600 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1600 CLBS, 27000 GATES | |
Clock Frequency-Max | 227 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | HQFP, | |
Pin Count | 160 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC4044XLA-9HQ160C Datasheet Download
XC4044XLA-9HQ160C Overview
The XC4044XLA-9HQ160C chip model is a powerful and versatile model that is designed to meet the needs of modern networks and communication systems. Developed by Xilinx, this chip model is equipped with advanced features that make it suitable for a wide range of applications. The chip model features a high-performance, low-power design that is ideal for a variety of communication systems.
The XC4044XLA-9HQ160C chip model is designed to enable a wide range of communication systems and networks, including wireless, wired, and optical networks. It is also capable of providing support for advanced communication protocols such as Ethernet, Wi-Fi, and Bluetooth. Additionally, the chip model can be used to enable intelligent systems, such as those used in artificial intelligence, machine learning, and robotics.
The XC4044XLA-9HQ160C chip model is designed to meet the specific requirements of modern communication systems. It is capable of providing high-speed data transfer rates, low latency, and low power consumption. Additionally, the chip model is equipped with advanced features such as programmable logic blocks, high-speed serial interfaces, and high-speed memory access.
The XC4044XLA-9HQ160C chip model can be used in a variety of applications, from simple communication systems to advanced intelligent systems. To ensure successful deployment of the chip model, it is important to understand its design requirements and features. Additionally, it is important to consider the specific design requirements of the application and the potential for future upgrades.
To ensure successful deployment of the XC4044XLA-9HQ160C chip model, it is important to consider the specific design requirements of the application and the potential for future upgrades. Additionally, it is important to consider the specific design requirements of the application and the potential for future upgrades. It is also important to consider the actual case studies and precautions that should be taken when using the chip model.
In conclusion, the XC4044XLA-9HQ160C chip model is a powerful and versatile model that is designed to meet the needs of modern networks and communication systems. It is capable of providing high-speed data transfer rates, low latency, and low power consumption. Additionally, the chip model is equipped with advanced features such as programmable logic blocks, high-speed serial interfaces, and high-speed memory access. The chip model can be used in a variety of applications, from simple communication systems to advanced intelligent systems. To ensure successful deployment of the chip model, it is important to understand its design requirements and features, as well as the potential for future upgrades and the actual case studies and precautions that should be taken when using the chip model.
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