
AMD Xilinx
XC4044XLA-09BG432C
XC4044XLA-09BG432C ECAD Model
XC4044XLA-09BG432C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 1600 | |
Number of Equivalent Gates | 27000 | |
Number of CLBs | 1600 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1600 CLBS, 27000 GATES | |
Additional Feature | CAN ALSO USE 80000 GATES | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA432,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-432 | |
Pin Count | 432 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4044XLA-09BG432C Datasheet Download
XC4044XLA-09BG432C Overview
The XC4044XLA-09BG432C chip model is a powerful tool for the development of advanced communication systems. Developed by Xilinx, the chip model is designed to provide a high-performance, low-power solution for the development of advanced communication systems. It has a wide range of features, including a wide range of high-speed data transfer protocols, a high-performance FPGA (Field Programmable Gate Array) architecture, and a low-power design.
The XC4044XLA-09BG432C chip model is a perfect example of the power of modern technology. It is capable of supporting a wide range of applications and communication protocols, making it an ideal choice for applications that require high-speed data transfer and low-power consumption. The chip model also offers a wide range of intelligent features, including an on-chip processor, an on-chip memory, and an on-chip network interface.
The XC4044XLA-09BG432C chip model can be used in a variety of applications and communication protocols, including wired and wireless networks, VoIP (Voice over Internet Protocol) communication, and intelligent systems. For example, it can be used in wireless networks to provide high-speed data transfer and low-power consumption, and in VoIP systems to provide a high-quality voice connection. Additionally, it can be used in intelligent systems to provide intelligent features such as on-chip processors, on-chip memory, and on-chip network interfaces.
The XC4044XLA-09BG432C chip model is also capable of being upgraded in the future. This is due to its modular design, which allows for the addition of new features and technologies as needed. This makes it an ideal choice for applications that require the support of new technologies. Additionally, it can be used in the era of fully intelligent systems, providing the necessary features and capabilities for intelligent applications.
In conclusion, the XC4044XLA-09BG432C chip model is a powerful tool for the development of advanced communication systems. Its wide range of features, including high-speed data transfer protocols, a high-performance FPGA architecture, and a low-power design, make it an ideal choice for applications that require the support of new technologies. Additionally, its modular design allows for the addition of new features and technologies as needed, making it an ideal choice for applications that require the support of new technologies, as well as for applications in the era of fully intelligent systems.
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