
AMD Xilinx
XC4044XLA-09BG352I
XC4044XLA-09BG352I ECAD Model
XC4044XLA-09BG352I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 1600 | |
Number of Equivalent Gates | 27000 | |
Number of CLBs | 1600 | |
Combinatorial Delay of a CLB-Max | 1.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1600 CLBS, 27000 GATES | |
Additional Feature | CAN ALSO USE 80000 GATES | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4044XLA-09BG352I Datasheet Download
XC4044XLA-09BG352I Overview
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The chip model XC4044XLA-09BG352I is capable of supporting the latest technologies and is suitable for a variety of applications, including networks and intelligent systems. It is important to understand the product description and specific design requirements of the chip model XC4044XLA-09BG352I, as well as its actual case studies and precautions, in order to determine which technologies are necessary for the application environment. By understanding the product description and design requirements, it is possible to determine which technologies are necessary for the application environment, as well as the possible future applications of the chip model XC4044XLA-09BG352I in networks and which intelligent scenarios it may be applied to.
In addition, it is important to consider the industry trends of the chip model XC4044XLA-09BG352I and the future development of related industries. By understanding the product description and design requirements, it is possible to determine which technologies are necessary for the application environment, as well as the possible future applications of the chip model XC4044XLA-09BG352I in networks and which intelligent scenarios it may be applied to. This will help to ensure that the chip model XC4044XLA-09BG352I is capable of supporting the latest technologies and is suitable for the current and future application environments.
In conclusion, the chip model XC4044XLA-09BG352I is a high-performance, low-power, and cost-effective chip that can be used in a variety of applications, including industrial, automotive, and consumer products. It is important to understand the product description and design requirements of the chip model XC4044XLA-09BG352I, as well as its actual case studies and precautions, in order to determine which technologies are necessary for the application environment. It is also important to consider the industry trends of the chip model XC4044XLA-09BG352I and the future development of related industries in order to ensure that the chip model XC4044XLA-09BG352I is capable of supporting the latest technologies and is suitable for the current and future application environments.
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