
AMD Xilinx
XC4044XLA-08BG352I
XC4044XLA-08BG352I ECAD Model
XC4044XLA-08BG352I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 1600 | |
Number of Equivalent Gates | 27000 | |
Number of CLBs | 1600 | |
Combinatorial Delay of a CLB-Max | 1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1600 CLBS, 27000 GATES | |
Additional Feature | CAN ALSO USE 80000 GATES | |
Clock Frequency-Max | 263 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA352,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | PLASTIC, BGA-352 | |
Pin Count | 352 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC4044XLA-08BG352I Datasheet Download
XC4044XLA-08BG352I Overview
The XC4044XLA-08BG352I chip model is a powerful and versatile tool for many industries. This chip is a high-performance, low-power microcontroller with a wide range of features, making it ideal for a variety of applications. It has a 32-bit RISC architecture and a wide range of peripherals, such as a USB port, LCD controller, and an ADC.
The XC4044XLA-08BG352I chip model is designed to meet the needs of a wide range of applications, including industrial, automotive, medical, and consumer products. Its low power consumption and high performance make it ideal for embedded systems, allowing for a wide range of applications.
The XC4044XLA-08BG352I chip model is designed to be compatible with a wide range of technologies, such as Bluetooth, Wi-Fi, Zigbee, and NFC. This makes it ideal for use in the Internet of Things (IoT) and other connected devices. It also supports a wide range of communication protocols, allowing for seamless connectivity with other devices.
The XC4044XLA-08BG352I chip model is also designed to be highly secure. It has a secure bootloader, which prevents unauthorized access to the device’s memory. It also has hardware-level encryption, which prevents data from being intercepted or modified.
The demand for the XC4044XLA-08BG352I chip model is expected to grow in the future, as more applications require the features and capabilities it offers. The chip’s low power consumption and wide range of features make it ideal for use in many industries, such as automotive, medical, and consumer products.
When considering the application environment, it is important to understand the specific technologies that are required. The XC4044XLA-08BG352I chip model is designed to be compatible with a wide range of technologies, allowing for seamless integration with other devices. It is also important to consider the security requirements of the application, as the chip model has a secure bootloader and hardware-level encryption.
In terms of design requirements, the XC4044XLA-08BG352I chip model has a wide range of features and peripherals, such as a USB port, LCD controller, and an ADC. It is important to understand the specific requirements of the application and ensure that the chip model meets these requirements. It is also important to consider the power requirements of the application, as the chip model has a low power consumption.
Finally, it is also important to consider actual case studies and precautions when using the XC4044XLA-08BG352I chip model. Understanding how the chip model is used in real-world applications can help to ensure that the application is successful. It is also important to consider any potential risks associated with the chip model, such as potential vulnerabilities or incompatibilities.
Overall, the XC4044XLA-08BG352I chip model is a powerful and versatile tool for many industries. Its low power consumption and wide range of features make it ideal for use in many applications. When considering the application environment, it is important to understand the specific technologies that are required and the design requirements of the application. Additionally, it is important to consider actual case studies and precautions when using the chip model. With these considerations in mind, the XC4044XLA-08BG352I chip model is expected to see increased demand in the future.
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3,710 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $187.1904 | $187.1904 |
10+ | $185.1776 | $1,851.7760 |
100+ | $175.1136 | $17,511.3600 |
1000+ | $165.0496 | $82,524.8000 |
10000+ | $150.9600 | $150,960.0000 |
The price is for reference only, please refer to the actual quotation! |