AMD Xilinx
XC4036XLA-09HQ160C
XC4036XLA-09HQ160C ECAD Model
XC4036XLA-09HQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 1296 | |
| Number of Equivalent Gates | 22000 | |
| Number of CLBs | 1296 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1296 CLBS, 22000 GATES | |
| Additional Feature | CAN ALSO USE 65000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQFP | |
| Package Equivalence Code | HQFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4036XLA-09HQ160C Datasheet Download
XC4036XLA-09HQ160C Overview
The XC4036XLA-09HQ160C chip model is a highly advanced and sophisticated chip model designed to meet the ever-growing needs of the technology industry. It is a highly versatile chip model that can be used in a variety of applications, from communication systems to advanced computing systems. It is capable of providing high-speed performance and reliability, making it a popular choice for many technology applications.
The XC4036XLA-09HQ160C chip model is designed to provide a high level of performance and reliability in a variety of applications. It is capable of providing a high-speed performance, with a wide range of features such as advanced signal processing, low-power operation, and a wide range of communication protocols. It is also designed to be highly reliable and resilient, with a wide range of features such as advanced error correction, self-calibration, and self-recovery.
The XC4036XLA-09HQ160C chip model is designed to provide a high level of performance and reliability in a variety of applications. It is capable of providing a high-speed performance, with a wide range of features such as advanced signal processing, low-power operation, and a wide range of communication protocols. It is also designed to be highly reliable and resilient, with a wide range of features such as advanced error correction, self-calibration, and self-recovery.
The XC4036XLA-09HQ160C chip model is designed to be highly versatile and can be used in a variety of applications. It is capable of providing a high-speed performance, with a wide range of features such as advanced signal processing, low-power operation, and a wide range of communication protocols. It is also designed to be highly reliable and resilient, with a wide range of features such as advanced error correction, self-calibration, and self-recovery.
In terms of industry trends, the XC4036XLA-09HQ160C chip model is designed to be highly versatile and can be used in a variety of applications. It is capable of providing a high-speed performance, with a wide range of features such as advanced signal processing, low-power operation, and a wide range of communication protocols. It is also designed to be highly reliable and resilient, with a wide range of features such as advanced error correction, self-calibration, and self-recovery.
The XC4036XLA-09HQ160C chip model is designed to be highly versatile and can be used in a variety of applications. It is also capable of being upgraded in the future, with the ability to incorporate new technologies and features as needed. The design of the chip model also includes a number of considerations to ensure that it is able to meet the requirements of the application environment and provide a high level of performance and reliability.
In terms of actual use cases and precautions, the XC4036XLA-09HQ160C chip model is designed to be highly versatile and can be used in a variety of applications. It is also capable of being upgraded in the future, with the ability to incorporate new technologies and features as needed. The design of the chip model also includes a number of considerations to ensure that it is able to meet the requirements of the application environment and provide a high level of performance and reliability.
When using the XC4036XLA-09HQ160C chip model, it is important to consider the specific requirements of the application. It is also important to consider potential risks and hazards associated with the use of the chip model, such as electromagnetic interference, overheating, and other potential problems. It is also important to consider the specific design requirements of the chip model, such as power requirements, signal integrity, and other important considerations.
In conclusion, the XC4036XLA-09HQ160C chip model is a highly advanced and sophisticated chip model designed to meet the ever-growing needs of the technology industry. It is capable of providing a high-speed performance, with a wide range of features such as advanced signal processing, low-power operation, and a wide range of communication protocols. It is also designed to be highly reliable and resilient, with a wide range of features such as advanced error correction, self-calibration, and self-recovery. It is also capable of being upgraded in the future, with the ability to incorporate new technologies and features as needed. When using the XC4036XLA-09HQ160C chip model, it is important to consider the specific requirements of the application, potential risks and hazards, and the specific design requirements of the chip model.
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