AMD Xilinx
XC4036XL-08BG352C
XC4036XL-08BG352C ECAD Model
XC4036XL-08BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 1296 | |
| Number of Equivalent Gates | 22000 | |
| Number of CLBs | 1296 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1296 CLBS, 22000 GATES | |
| Additional Feature | TYPICAL GATES = 22000-65000 | |
| Clock Frequency-Max | 238 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4036XL-08BG352C Datasheet Download
XC4036XL-08BG352C Overview
The XC4036XL-08BG352C chip model is a cutting-edge technology developed by Xilinx Corporation. This model is designed to provide high-end performance and reliability in a wide range of applications. It is a highly integrated and low-power solution that can be used in various types of embedded systems, such as automotive, industrial, and consumer applications.
The XC4036XL-08BG352C chip model has many advantages over other chip models. It has a smaller footprint than other models, making it easier to integrate into existing systems. It also has a higher clock speed, allowing it to process data faster and more efficiently. Additionally, it is highly reliable, with a low failure rate and low power consumption.
The XC4036XL-08BG352C chip model is expected to have a strong demand in the future due to its superior performance and reliability. It is expected to be used in a variety of applications, such as industrial automation, medical devices, and consumer electronics. It is also expected to be used in more advanced communication systems, such as 5G networks, as well as in the development and popularization of intelligent robots.
The XC4036XL-08BG352C chip model is designed to be flexible and can be easily upgraded to meet the needs of future applications. It is also designed to be compatible with a variety of communication protocols, allowing it to be used in a variety of communication systems. In order to use the model effectively, it is important to have a strong understanding of the communication protocols and the underlying hardware. Additionally, it is important to have a good understanding of the programming languages and development tools used to program the chip.
In conclusion, the XC4036XL-08BG352C chip model is a highly advanced and reliable solution that can be used in a variety of applications. It is expected to have a strong demand in the future due to its superior performance and reliability. It is also designed to be flexible and can be easily upgraded to meet the needs of future applications. In order to use the model effectively, it is important to have a strong understanding of the communication protocols and the underlying hardware, as well as a good understanding of the programming languages and development tools used to program the chip.
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|---|---|---|
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