AMD Xilinx
XC4036EX-3BG352C
XC4036EX-3BG352C ECAD Model
XC4036EX-3BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 1296 | |
| Number of Equivalent Gates | 22000 | |
| Number of CLBs | 1296 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1296 CLBS, 22000 GATES | |
| Additional Feature | MAX USABLE 36000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4036EX-3BG352C Datasheet Download
XC4036EX-3BG352C Overview
The XC4036EX-3BG352C chip model is a high-performance, low-cost programmable logic device from Xilinx. It is designed to offer a wide range of features and flexibility to meet the needs of a variety of applications. The chip model is based on the Xilinx XC4000 family of programmable logic devices, and is optimized for applications requiring high performance and low cost.
The XC4036EX-3BG352C chip model is designed to provide a wide range of features and flexibility. It has a wide range of features including a large number of I/O pins, high speed memory, and advanced logic functions. The chip model also has a wide range of programming options, including the ability to program and reprogram the device using a variety of programming languages.
The XC4036EX-3BG352C chip model is designed to meet the needs of a variety of applications. It is suitable for use in a wide range of applications, including communications systems, industrial automation, medical devices, and consumer electronics. The chip model is also suitable for use in advanced communication systems, such as those used in military, aerospace and telecommunications applications.
The XC4036EX-3BG352C chip model is designed to provide high performance and low cost. It is capable of handling a wide range of data rates and protocols, and is suitable for use in both high-speed and low-speed applications. The chip model also has a wide range of programming options, including the ability to program and reprogram the device using a variety of programming languages.
The XC4036EX-3BG352C chip model is designed to be highly reliable and robust. It is designed to be resistant to environmental conditions such as temperature, humidity and vibration. The chip model also has a wide range of features and flexibility, allowing it to be used in a variety of applications.
The XC4036EX-3BG352C chip model is expected to be in high demand in the future, as more and more applications require high performance and low cost solutions. The chip model is also expected to be used in a wide range of applications, including communications systems, industrial automation, medical devices and consumer electronics.
The XC4036EX-3BG352C chip model is designed to be highly upgradeable and can be used in a variety of applications. The chip model is capable of being upgraded to meet the needs of more advanced applications, such as those used in military, aerospace and telecommunications applications.
The XC4036EX-3BG352C chip model is designed to meet the specific design requirements of a variety of applications. The chip model is designed to provide a wide range of features and flexibility, and is capable of handling a wide range of data rates and protocols. The chip model is also designed to be highly reliable and robust, and is resistant to environmental conditions such as temperature, humidity and vibration.
The XC4036EX-3BG352C chip model has been used in a variety of applications, including communications systems, industrial automation, medical devices and consumer electronics. In each of these applications, the chip model has been found to be highly reliable and robust, and has been able to meet the specific design requirements of the application.
When using the XC4036EX-3BG352C chip model, it is important to ensure that the device is properly programmed and configured. It is also important to ensure that the device is used in accordance with the specific design requirements of the application. It is also important to ensure that the device is properly maintained and that any upgrades are properly installed. Failure to do so could result in the device malfunctioning or failing to meet the specific design requirements of the application.
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