XC4036EX-2BG352C
XC4036EX-2BG352C
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rohs

AMD Xilinx

XC4036EX-2BG352C


XC4036EX-2BG352C
F20-XC4036EX-2BG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, BGA-352
PLASTIC, BGA-352

XC4036EX-2BG352C ECAD Model


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XC4036EX-2BG352C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 288
Number of Outputs 288
Number of Logic Cells 1296
Number of Equivalent Gates 22000
Number of CLBs 1296
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1296 CLBS, 22000 GATES
Additional Feature MAX USABLE 36000 LOGIC GATES
Clock Frequency-Max 166 MHz
Power Supplies 5 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description PLASTIC, BGA-352
Pin Count 352

XC4036EX-2BG352C Datasheet Download


XC4036EX-2BG352C Overview



The XC4036EX-2BG352C is a chip model developed by Xilinx, one of the world's leading suppliers of programmable logic components. This chip model is designed to be a powerful and versatile solution for a wide range of applications. It is the latest in a series of high-performance, low-power, and cost-effective chips that Xilinx has developed.


The XC4036EX-2BG352C chip model is a highly advanced and sophisticated model that provides a wide range of features and functions. It is designed for use in a variety of applications, such as communication systems, industrial control systems, and embedded systems. It has a wide range of features, including high-speed I/O, high-speed bus interfaces, and a wide range of memory and logic resources.


The XC4036EX-2BG352C chip model is designed to be highly efficient, providing low power consumption and high performance. It is also designed to be highly reliable, with a long lifetime and low failure rate. It is designed to be highly scalable, allowing for future upgrades and modifications.


The XC4036EX-2BG352C chip model is expected to be in high demand in the future, as it is a highly advanced and cost-effective solution for a wide range of applications. It is expected to be used in a variety of industries, such as communication systems, industrial control systems, and embedded systems. It has the potential to be used in advanced communication systems, such as 5G and beyond.


The XC4036EX-2BG352C chip model is also expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It has the potential to be used in the era of fully intelligent systems, such as the Internet of Things (IoT). It is expected to be used in networks, such as wireless networks and the cloud.


The XC4036EX-2BG352C chip model is a highly advanced and sophisticated model that provides a wide range of features and functions. It is expected to be in high demand in the future, as it is a highly advanced and cost-effective solution for a wide range of applications. It is expected to be used in a variety of industries, such as communication systems, industrial control systems, and embedded systems. It has the potential to be used in advanced communication systems, such as 5G and beyond, as well as a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It is expected to be used in networks, such as wireless networks and the cloud, and has the potential to be used in the era of fully intelligent systems, such as the Internet of Things (IoT).



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