AMD Xilinx
XC4028XLA-7BG352C
XC4028XLA-7BG352C ECAD Model
XC4028XLA-7BG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4028XLA-7BG352C Datasheet Download
XC4028XLA-7BG352C Overview
The XC4028XLA-7BG352C chip model is an advanced, high-performance device designed for digital signal processing, embedded processing, and image processing. It is suitable for applications that require the use of HDL language, and is capable of providing high performance and reliability.
The original design intention of the XC4028XLA-7BG352C chip model was to create a device that could provide a high level of performance and reliability for digital signal processing, embedded processing, and image processing applications. The chip model is designed to be upgradable, allowing for future improvements and upgrades. This makes it possible for the chip model to be used in advanced communication systems, as it can be adapted to meet the specific requirements of the system.
The product description and specific design requirements of the XC4028XLA-7BG352C chip model include the ability to process digital signals, embedded processing, and image processing. The chip model is designed to handle a variety of data types and can be used for a variety of applications. It is also designed to be energy efficient, reducing power consumption and providing a longer battery life.
Actual case studies and precautions should be taken when using the XC4028XLA-7BG352C chip model. It is important to ensure that the design meets the specific requirements of the application, as well as the specific needs of the system. It is also important to consider the power consumption of the device and the potential for overheating. Additionally, it is important to ensure that the design meets the safety requirements of the system, as well as any other applicable regulations.
Overall, the XC4028XLA-7BG352C chip model is a highly advanced and reliable device designed for digital signal processing, embedded processing, and image processing. It is capable of providing high performance and reliability, and can be used in advanced communication systems. It is important to consider the design requirements, power consumption, and safety regulations when using the XC4028XLA-7BG352C chip model.
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