AMD Xilinx
XC4028XLA-09HQ240C
XC4028XLA-09HQ240C ECAD Model
XC4028XLA-09HQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 256 | |
| Number of Outputs | 256 | |
| Number of Logic Cells | 1024 | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP240,1.37SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC4028XLA-09HQ240C Datasheet Download
XC4028XLA-09HQ240C Overview
The XC4028XLA-09HQ240C chip model is a powerful device designed for high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language and offers a wide range of features, making it ideal for a variety of applications.
The XC4028XLA-09HQ240C chip model is designed to meet the specific needs of its users. It has a high-performance architecture, allowing it to process data quickly and accurately. It also has a wide range of features, such as a high-speed memory interface, a large number of I/O pins, and an integrated high-speed DSP core, making it suitable for a variety of applications.
The XC4028XLA-09HQ240C chip model is expected to be in high demand in the future, as it is ideal for a variety of applications. It is suitable for applications such as digital signal processing, embedded processing, image processing, and other high-performance applications. With its powerful architecture, the XC4028XLA-09HQ240C chip model can easily handle large amounts of data and process it quickly and accurately.
In order to make the most of the XC4028XLA-09HQ240C chip model, it is important to understand the product description and design requirements. The product description includes information about the chip model’s architecture, features, and performance. Design requirements include the type of HDL language to be used and how to best utilize the chip model’s features. It is also important to consider actual case studies and any potential risks associated with the chip model.
Overall, the XC4028XLA-09HQ240C chip model is a powerful device designed for high-performance digital signal processing, embedded processing, and image processing. With its wide range of features and expected demand in the future, it is an ideal choice for a variety of applications. It is important to understand the product description and design requirements in order to make the most of the chip model, as well as to consider any potential risks associated with it.
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|---|---|---|
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