AMD Xilinx
XC4028XLA-09BGG256C
XC4028XLA-09BGG256C ECAD Model
XC4028XLA-09BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 227 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4028XLA-09BGG256C Datasheet Download
XC4028XLA-09BGG256C Overview
The XC4028XLA-09BGG256C chip model is a powerful and versatile chip that has been designed to meet the demands of a wide range of applications. It is a high-performance, low-power device that is suitable for a variety of applications, including embedded systems, wireless networks, and consumer electronics.
The XC4028XLA-09BGG256C chip model is built on a 32-bit architecture and features an integrated memory controller, a high-speed memory interface, and a high-speed signal processing unit. It is capable of processing large amounts of data quickly and efficiently, making it ideal for applications that require high throughput and low latency. Additionally, the chip model supports a wide range of communication protocols, making it suitable for a variety of network applications.
The XC4028XLA-09BGG256C chip model has been designed to be used in a variety of intelligent scenarios, including the Internet of Things (IoT), autonomous vehicles, and smart home systems. It is capable of supporting a wide range of sensors and actuators, allowing for the development of sophisticated and complex systems. Additionally, the chip model is capable of being used in fully intelligent systems, as it is capable of handling data from multiple sources and performing complex operations.
The product description of the XC4028XLA-09BGG256C chip model states that it is a highly reliable and cost-effective solution for a wide range of applications. It is designed to provide high performance and low power consumption, making it suitable for a variety of applications. Additionally, the chip model is designed to be used in a variety of intelligent scenarios, allowing for the development of sophisticated and complex systems.
When it comes to the industry trends of the XC4028XLA-09BGG256C chip model and the future development of related industries, it is important to consider what new technologies are needed in order to support the application environment. As technology continues to evolve, the XC4028XLA-09BGG256C chip model will need to be updated in order to keep up with the changing landscape. Additionally, it is important to consider the actual case studies and precautions when using the chip model, as well as the possible future applications it may be used for in networks and other intelligent scenarios.
Overall, the XC4028XLA-09BGG256C chip model is a powerful and versatile chip that has been designed to meet the demands of a wide range of applications. It is capable of supporting a wide range of communication protocols, making it suitable for a variety of network applications. Additionally, the chip model is capable of being used in fully intelligent systems, as it is capable of handling data from multiple sources and performing complex operations. As technology continues to evolve, it is important to consider what new technologies are needed in order to support the application environment, as well as the actual case studies and precautions when using the chip model.
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2,400 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $87.7448 | $87.7448 |
| 10+ | $86.8013 | $868.0126 |
| 100+ | $82.0838 | $8,208.3804 |
| 1000+ | $77.3663 | $38,683.1720 |
| 10000+ | $70.7619 | $70,761.9000 |
| The price is for reference only, please refer to the actual quotation! | ||