AMD Xilinx
XC4028XLA-08HQ160C
XC4028XLA-08HQ160C ECAD Model
XC4028XLA-08HQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 256 | |
| Number of Outputs | 256 | |
| Number of Logic Cells | 1024 | |
| Number of Equivalent Gates | 18000 | |
| Number of CLBs | 1024 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1024 CLBS, 18000 GATES | |
| Additional Feature | CAN ALSO USE 50000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HQFP | |
| Package Equivalence Code | HQFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP-160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 160 |
XC4028XLA-08HQ160C Datasheet Download
XC4028XLA-08HQ160C Overview
The XC4028XLA-08HQ160C chip model is a cutting-edge technology that is designed to provide a wide range of applications. This model is highly efficient and can be used in a variety of industries, including telecommunication, automotive, and medical. It is also suitable for the development of intelligent robots.
The XC4028XLA-08HQ160C chip model has a number of advantages that make it an ideal choice for various industries. Firstly, it has a high-speed, low-power consumption design, which makes it suitable for use in mobile, wireless, and other communication systems. Secondly, it has a wide range of processing capabilities, allowing it to handle complex tasks quickly and efficiently. Thirdly, it has a high level of integration, meaning that it can be used to create systems with fewer components, resulting in lower costs and improved performance. Finally, it is easy to use and can be programmed for a wide range of applications.
As the demand for advanced communication systems continues to grow, the XC4028XLA-08HQ160C chip model is expected to be in high demand. This model is suitable for a wide range of applications, including high-speed data transmission, wireless communication, and machine-to-machine communication. It is also suitable for the development of intelligent robots, as it can be used to process complex tasks quickly and efficiently.
The XC4028XLA-08HQ160C chip model is designed to be upgradeable, allowing it to be used in future communication systems. It is also suitable for use in advanced communication systems, as it has a high level of integration and can be used to create systems with fewer components. In addition, it is easy to use and can be programmed for a wide range of applications.
In order to use the XC4028XLA-08HQ160C chip model effectively, it is important to have the right technical skills. This includes knowledge of programming languages, as well as an understanding of the underlying hardware and software. It is also important to have an understanding of the different components of the chip model, as well as the capabilities of the model and its potential applications. With the right technical skills, the XC4028XLA-08HQ160C chip model can be used to develop and popularize future intelligent robots.
In conclusion, the XC4028XLA-08HQ160C chip model is a highly efficient and versatile model that is suitable for use in a wide range of industries. It is expected to be in high demand in the future due to its high-speed, low-power consumption design and its wide range of processing capabilities. It is also upgradeable and can be used in advanced communication systems. Finally, it is suitable for the development and popularization of future intelligent robots, provided that the right technical skills are in place.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||